Multilayer Capacitor Interface Composition for Electrode Bonding
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Solution Overview
Problem
The heat shrinkage temperature difference between the dielectric layer and the internal electrode in multilayered capacitors leads to deteriorated electrode connectivity and reliability, which is exacerbated by the use of nano-sized barium titanite co-materials that reduce layer density and capacitance.
Innovation Solution
Incorporating a MAX phase compound and controlled amounts of Sn at the interface between the dielectric and internal electrodes, enhancing interfacial bonding through transient liquid diffusion bonding during sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If nano-sized barium titanite co-material is added to the internal electrode to reduce heat shrinkage temperature difference, then heat shrinkage temperature difference is reduced, but layer density decreases and capacitance is reduced
Solution Approach 1:
The patent introduces a specific compound (BaTiO3 with 0.01-0.1 wt% SnO2 addition) as an intermediary material at the interface between the dielectric layer and internal electrode. This intermediary compound acts as a buffer that reduces the heat shrinkage temperature difference while maintaining layer density and electrode connectivity, resolving the contradiction between temperature matching and reliability.
Solution Approach 2:
The patent changes the chemical composition parameters of the internal electrode by adding a specific compound with controlled SnO2 content (0.01-0.1 wt%). This parameter change modifies the thermal properties of the internal electrode to reduce heat shrinkage temperature difference while the controlled low concentration prevents degradation of layer density and capacitance.
2Temperature
If barium titanite co-material content is increased to reduce heat shrinkage temperature difference, then heat shrinkage temperature difference is reduced, but dielectric layer thickness increases and capacitance is reduced
Solution Approach 1:
The patent precisely controls the composition parameters of the added compound, specifying SnO2 content between 0.01-0.1 wt%. This controlled parameter change achieves the desired temperature matching effect while preventing excessive dielectric layer thickening that would reduce capacitance.
Solution Approach 2:
The patent applies the BaTiO3-based compound specifically at the interface region between the dielectric layer and internal electrode rather than uniformly throughout. This localized application reduces heat shrinkage temperature difference at the critical interface without significantly increasing overall dielectric layer thickness or reducing capacitance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves electrode connectivity and interfacial bonding force, resulting in stable capacitor characteristics with enhanced reliability and capacitance.
Implementation Method 1
enhancing interfacial bonding through transient liquid diffusion bonding during sintering
Data Source
AI summary
A multilayered capacitor according to an embodiment includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body. The dielectric layer includes a central portion of the dielectric layer and an interface portion of the dielectric layer on a surface of the central portion of the dielectric layer and in contact with the internal electrode, the interface portion of the dielectric layer includes Sn. The internal electrode may include a first compound represented by Chemical Formula 1. The internal electrode may include a second compound represented by Chemical Formula 2.