Multilayer Capacitor Protective Grain Structure for Moisture Reliability
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with degradation in moisture resistance reliability and short circuits due to minimal formation of margin portions, which expose internal electrodes and reduce the moisture permeation path.
Innovation Solution
A multilayer electronic component design featuring a protective portion with smaller dielectric grains on the surfaces of the multilayer portion, extending the moisture permeation path and minimizing short circuits by connecting to the internal electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of cover portion or margin portion is reduced to maximize capacitance formation area, then capacitance per unit volume is improved, but moisture resistance reliability deteriorates
Solution Approach 1:
The patent applies local quality by forming a protective portion with different properties (smaller dielectric grains) at specific locations (side surfaces) of the multilayer electronic component. This localized structural modification provides enhanced moisture protection at critical areas without requiring uniform thickness increase throughout the entire component, thus maintaining high capacitance density while improving moisture resistance reliability.
2Quantity of substance
If margin portion is minimized to increase capacitance formation area, then capacitance per unit volume is improved, but short circuit risk increases due to exposed internal electrode
Solution Approach 1:
The protective portion is formed specifically at the side surfaces where internal electrodes are exposed during polishing. This localized protection provides the necessary coverage to prevent short circuits at critical exposure points while minimizing the overall margin portion thickness, thereby maintaining high capacitance density without compromising short circuit resistance.
3Reliability
If protective portion with smaller dielectric grains is formed on side surfaces, then moisture permeation path is lengthened and moisture resistance reliability is improved, but device complexity increases
Solution Approach 1:
The protective portion is formed as a distinct segmented structure with different dielectric grain characteristics from the main body. This segmentation allows for targeted moisture protection at side surfaces through a separate formation process, achieving enhanced reliability while maintaining clear functional boundaries that simplify manufacturing control and process management.
Data Source
AI summary
A multilayer electronic component includes a multilayer portion having a dielectric layer and internal electrodes alternately disposed in a first direction. The multilayer portion has first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction perpendicular to the first direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A protective portion is disposed on the third and fourth surfaces, and external electrodes are disposed on the multilayer portion and the protective portion, electrically connected to the internal electrodes. The dielectric layer comprises first dielectric grains, and the protective portion comprises second dielectric grains with an average grain size smaller than that of the first dielectric grains.