Multilayer Capacitor with Overcurrent Protection and Vibration Damping
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Solution Overview
Problem
Existing electronic components with multilayer capacitors face issues with overcurrent flow when short-circuiting, leading to potential damage and vibration due to electrostrictive effects, which are not effectively addressed by current designs.
Innovation Solution
Incorporating an overcurrent protection device connected in series with the multilayer capacitor, along with leg portions that absorb electrostrictive vibrations, to prevent overcurrent flow and reduce mechanical strain, thereby enhancing support strength and suppressing vibration propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer capacitor is used without an overcurrent protection device, then the device complexity is reduced, but overcurrent may flow when the capacitor short-circuits causing potential damage
Solution Approach 1:
The patent combines the multilayer capacitor and overcurrent protection device into a single integrated electronic component. The capacitor element and protection device are disposed on opposite surfaces of a common substrate, sharing the same package structure and external terminals, thereby providing overcurrent protection without requiring a separate discrete component.
Solution Approach 2:
The integrated electronic component serves multiple functions simultaneously: energy storage/coupling through the capacitor and overcurrent protection through the protection device. This multi-functional design eliminates the need for separate components while maintaining both capabilities within a single package.
2Object-affected harmful factors
If the multilayer capacitor is directly mounted on the substrate without leg portions, then the device complexity is reduced, but electrostrictive vibrations may propagate causing mechanical strain and noise
Solution Approach 1:
The patent introduces leg portions as intermediary elements between the capacitor element and the substrate. These leg portions act as vibration-absorbing intermediaries that decouple the capacitor from direct mounting on the substrate, thereby suppressing the propagation of electrostrictive vibrations to the substrate and other components.
Solution Approach 2:
The leg portions serve as pre-configured cushioning elements that absorb and dampen vibrations before they can propagate to the substrate. This beforehand cushioning prevents mechanical strain and noise generation by intercepting vibration energy at its source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents overcurrent flow and suppresses vibration, enhancing the reliability and stability of the electronic component by integrating an overcurrent protection device and leg portions that absorb electrostrictive vibrations, thus reducing the risk of damage and noise.
Implementation Method 1
the overcurrent protection device prevents overcurrent from flowing between the first and second metal terminals
Implementation Method 2
vibration due to electrostrictive effects
Implementation Method 3
leg portions that absorb electrostrictive vibrations
Data Source
AI summary
A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.