Multilayer Ceramic Component Glass Coating Stress Relief
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Solution Overview
Problem
As electronic components increase in size to enhance capacitance or current, mechanical stress due to differences in linear expansion coefficients between circuit board materials and ceramic materials can cause them to break, necessitating the use of lead terminals for mounting, which can be prone to positional errors and reliability issues.
Innovation Solution
A multilayer electronic component is produced by alternately stacking ceramic layers and internal electrodes, forming external electrodes with a glass coating for insulation, and connecting lead terminals to plated external electrodes to distribute stress and ensure accurate mounting on a circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of electronic component is increased to increase capacitance or current, then the capacitance or current capacity is improved, but mechanical stress is caused due to difference in linear expansion coefficient which would likely cause the electronic component to be broken
Solution Approach 1:
A glass coating layer is applied as an intermediary between the ceramic component and the external environment. This glass coating has thermal expansion properties that mediate between the ceramic substrate and the mounting board, reducing mechanical stress during temperature cycles and preventing component failure while maintaining increased component size for higher capacitance.
2Strength
If lead terminals are attached to external terminals to avoid breakage, then the mechanical strength is improved, but positional errors and reliability issues occur during mounting
Solution Approach 1:
The lead terminals are extracted from the component body and formed as separate, protruding structures. This allows the main ceramic body to maintain precise dimensions for mounting while the separate lead terminals provide mechanical reinforcement and electrical connection, eliminating positional errors associated with integrated lead designs.
3Reliability
If a glass coating is applied over the entire sintered body, then the insulating performance is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The glass coating application is merged with the existing sintering process. The green body is coated with glass material before the first sintering step, combining the coating application and initial sintering into a single process sequence. This reduces manufacturing complexity while ensuring complete insulating coverage of the ceramic component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable electric connection and enhances the reliability of the multilayer electronic component by reducing mechanical stress and improving mounting accuracy, preventing component breakage and positional errors.
Implementation Method 1
An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body
Data Source
AI summary
A sintered body that includes ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.