Multilayer Ceramic Chip Cutting With Dual-Sided Laser Ablation

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Solution Overview

Problem

Existing methods for cutting ceramic laminates in multilayer ceramic capacitors face issues such as deformation, cracks, and chip sticking due to direct contact with blades, and inefficient processing with lasers that cause non-uniform cross-sections and reliability issues.

Innovation Solution

A method involving laser irradiation on both surfaces of the ceramic laminate to cut it into individual chips, preventing deformation and cracks, and improving processing efficiency by controlling the cross-section shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a blade is used to cut the ceramic laminate, then the cutting process is simple and direct, but deformation occurs in the ceramic laminate and cracks may occur due to shear stress

Engineering Contradiction:

Improvecutting process simplicityVSAvoidceramic laminate deformation

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical blade cutting system with a laser-based cutting system. The laser beam cuts the ceramic laminate without physical contact, eliminating mechanical deformation and shear stress cracks while maintaining manufacturing simplicity through automated laser control

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a laser beam as an intermediary between the cutting source and the ceramic laminate. This intermediary enables cutting without direct mechanical contact, preventing deformation and cracks while achieving precise cuts

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If a laser is used to cut the ceramic laminate, then processing speed increases, but the processing line width increases causing diagonal cuts and trapezoidal cross-sections

Engineering Contradiction:

Improveprocessing speedVSAvoidcut cross-section shape

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent transitions from single-sided laser cutting to dual-sided laser cutting, adding the dimension of bidirectional processing. This enables precise control of the cut path from both surfaces simultaneously, maintaining a straight cut line and rectangular cross-section while preserving high processing speed

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies laser cutting with different parameters or focal positions on each surface of the ceramic laminate. By optimizing the local cutting conditions on each surface, the process achieves both high speed and precise rectangular cross-sections without diagonal cuts

Inventive Principle:

Principle #3Local quality

3Reliability

If the laser processing depth increases, then the cutting effectiveness improves, but the processing speed decreases

Engineering Contradiction:

Improvecutting effectivenessVSAvoidprocessing speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent divides the cutting process into two separate passes, one from each surface of the ceramic laminate. Each pass handles a portion of the total cutting depth, allowing the laser to maintain shallow focal depth for high speed while achieving complete penetration through coordinated dual-sided processing

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach prevents chip sticking and cracks, enhances processing speed, and improves the reliability of multilayer ceramic capacitors by ensuring uniform external electrode formation.

Implementation Method 1

cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS12444540B2Multilayer electronic component with curved side surfaces

Publication Date: 2025.10.14 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A method of manufacturing a multilayer electronic component includes forming a ceramic laminate in which a plurality of ceramic green sheets and a plurality of internal electrode patterns are stacked in a first direction; cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction; firing one of the multilayer chips so as to form a ceramic body including an internal electrode and a dielectric layer; and forming external electrodes on a first side and a second side of the ceramic body.