Multilayer Chipset Structure with Vertical Wiring Openings
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Solution Overview
Problem
Prior art semiconductor multilayer packaging structures require complex winding of conduction wires to connect circuit boards and chips, increasing assembly time and cost, and reducing heat dissipation due to added epoxy thickness.
Innovation Solution
A multilayer chipset structure with wiring and chipset openings in circuit boards allows connecting wires to pass through, simplifying the assembly by stacking chips and circuit boards with exposed welding pads, reducing wire path lengths, and eliminating the need for epoxy on all sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conduction wires are wound and curved to connect welding pads on different circuits, then the connections can be made flexible, but the assembly time increases dramatically and the work becomes difficult
Solution Approach 1:
The patent transitions from planar wire routing to three-dimensional vertical stacking. Circuit boards are arranged in multiple layers with wiring openings that allow connecting wires to pass through vertically, converting horizontal wire routing into vertical through-hole connections. This dimensional change eliminates the need for complex winding and curving of wires, significantly reducing assembly time while maintaining connection flexibility.
Solution Approach 2:
The patent divides the circuit board into multiple layers with distinct wiring openings and chipset openings. Each layer is segmented with specific opening positions that align vertically, allowing connecting wires to pass through multiple layers sequentially. This segmentation enables straightforward through-hole wiring without requiring wires to wind across the board surface, reducing assembly complexity and time.
2Reliability
If epoxy is added to different surfaces for packaging, then the structure is protected, but the thickness of the whole structure increases and heat dissipation effect reduces
Solution Approach 1:
The patent adopts vertical stacking of circuit boards with wiring openings, concentrating all connecting wires on the upper side only. This eliminates the need for epoxy packaging on bottom and side surfaces, reducing the overall thickness of the packaged structure. The reduced thickness improves heat dissipation pathways while maintaining protection on the essential upper surface where all wire connections are located.
Solution Approach 2:
The patent extracts the epoxy packaging requirement from all surfaces and retains it only on the upper surface where all connecting wires are concentrated. By removing epoxy from bottom and side surfaces, the structure thickness is reduced and heat dissipation is improved, while the essential protective function is maintained on the upper surface where all connections are exposed.
3Adaptability or versatility
If conduction wires are arranged on different positions of circuit boards to suit welding pads, then all connections can be made, but the device complexity increases dramatically
Solution Approach 1:
The patent introduces vertical stacking with wiring openings that align across multiple layers. Connecting wires pass through these openings vertically, eliminating the need for complex horizontal routing across different board positions. The vertical alignment of openings simplifies wire arrangement while maintaining the ability to connect all necessary welding pads across layers.
Solution Approach 2:
The patent creates a universal wiring opening structure that serves multiple functions: it provides alignment references for wire routing, establishes vertical connection pathways, and defines chipset mounting positions. This multi-functional opening design simplifies the overall wire arrangement while enabling comprehensive connection coverage across all layers and components.
Data Source
AI summary
A multilayer chipset structure is provided. The chips can be arranged in a stacking structure with multilayer circuit board. Each circuit board is formed with wiring opening and chipset opening. The chipset opening can be arranged with at least one chipset, such as a controller. The different openings cause connecting wires can pass therethrough so as to connect different chips or circuit elements on different layer. By this modularized structure, the multilayer package structure can be formed with a complicated structure in one package so as to reduce the packaging cost effectively. The connecting wires pass through the openings so as to reduce the whole path lengths needed. No complicated wiring is needed. All the conducting wires are at an upper side of the chips. In packaging, it only needs to package the upper side.