Multilayer Circuit Board Laser Direct Structuring Additive
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Solution Overview
Problem
Conventional multilayer circuit boards face difficulties in forming complex and fine conductive patterns, especially on side surfaces parallel to the lamination direction, which limits their ability to create desired conductive patterns effectively.
Innovation Solution
The method involves using Laser Direct Structuring additives that change upon laser irradiation, allowing for the patterning and plating of conductive patterns on both inner and outer surfaces of the laminate, including side surfaces, to form intricate and accurate conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional patterning methods are used to form conductive patterns on insulating substrates, then simple patterns can be formed, but complex and fine conductive patterns especially on side surfaces cannot be formed effectively
Solution Approach 1:
The patent replaces conventional mechanical patterning methods (photolithography, etching) with a laser-based direct structuring system. The laser beam directly writes conductive patterns on the insulating substrate surface by inducing localized chemical changes, enabling formation of complex fine patterns on any surface including side surfaces without mechanical contact or complex alignment procedures
Solution Approach 2:
The patent changes the physical and chemical parameters of the insulating substrate by incorporating Laser Direct Structuring (LDS) additives that undergo specific chemical transformations when irradiated by laser. This parameter change enables the substrate to develop conductive properties only in laser-irradiated areas, allowing versatile pattern formation on diverse surfaces
2Manufacturing precision
If conductive patterns are made finer and more complicated to meet design requirements, then signal transmission quality improves, but the difficulty of forming desired patterns increases
Solution Approach 1:
The laser-based direct structuring system eliminates the need for complex mechanical patterning processes such as photolithography and etching that become increasingly difficult with finer patterns. The laser beam can be precisely controlled to write arbitrary fine patterns directly, dramatically simplifying the manufacturing of complex fine conductive patterns
Solution Approach 2:
The patent incorporates LDS additives into the insulating substrate material in advance, preparing the substrate to respond to laser irradiation by developing conductive properties. This preliminary preparation simplifies the subsequent patterning process, as the laser only needs to irradiate the pre-prepared substrate to form the desired fine patterns without requiring complex multi-step manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reliable formation of various conductive patterns with reduced transmission loss and improved flexibility, while maintaining structural strength, by allowing for the creation of complex geometries and connections on the multilayer circuit board.
Implementation Method 1
adding a Laser Direct Structuring additive, which includes properties that change upon laser irradiation, to the insulating substrates, and patterning a surface of a portion to which the Laser Direct Structuring additive is added with laser irradiation
Implementation Method 2
plating a patterned area with a conductor
Data Source
AI summary
A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.