Multilayer Circuit Module Shield Electrode Warping
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Solution Overview
Problem
Multilayer circuit boards experience warping and distortion due to differing thermal contraction rates of insulator layers and patterned wires, leading to reduced connection reliability between shield and ground electrodes, which compromises shielding functionality.
Innovation Solution
Incorporating extended electrodes that connect to the inner-layer ground electrode and are exposed at the side surface, overlapping with the inner-layer ground electrode, to increase connection reliability and reduce warping by distributing conductor density uniformly, and optionally using barium aluminum silicate paste layers to enhance structural uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the multilayer board is formed by stacking and pressure-bonding insulator layers with patterned wires, then the board structure is created, but warping or distortion occurs due to different contraction rates
Solution Approach 1:
The patent applies local quality by strategically placing dummy electrodes in specific regions where patterned wire density is high. These dummy electrodes locally adjust the conductor distribution to balance thermal contraction forces in those specific areas, preventing warping without requiring changes to the entire board structure.
Solution Approach 2:
The patent changes the physical parameters of the board by adding dummy electrodes that modify the overall conductor density and distribution. This parameter change compensates for the differential contraction between insulator layers and patterned wires, maintaining board flatness during thermal processing.
2Area of stationary object
If the multilayer board warps or distorts, then the contact area between inner-layer ground electrode and shield electrode is reduced, but connection reliability deteriorates
Solution Approach 1:
The patent implements preliminary action by pre-positioning dummy electrodes within the inner layer during board fabrication. These dummy electrodes are strategically placed before final assembly to ensure that the inner-layer ground electrode maintains proper alignment and contact area with the shield electrode, preventing connection reliability issues that would arise from warping.
3Ease of manufacture
If the density of patterned wires differs between insulator layers, then the board is formed, but differential contraction causes warping
Solution Approach 1:
The patent applies local quality by strategically placing dummy electrodes in specific regions where patterned wire density is high. These dummy electrodes locally adjust the conductor distribution to balance thermal contraction forces in those specific areas, preventing warping without requiring changes to the entire board structure.
Solution Approach 2:
The patent strives for homogeneity by adding dummy electrodes that compensate for non-uniform patterned wire density across different insulator layers. This creates a more homogeneous overall conductor distribution, balancing thermal contraction characteristics throughout the multilayer board structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances connection reliability between the shield and inner-layer ground electrodes, improves shielding functionality, and reduces warping and distortion of the multilayer board, maintaining module characteristics while preventing structural issues.
Implementation Method 1
each insulator layer has patterned wires formed thereon. The density of the patterned wires differs between the insulator layers, and the insulator layers and the patterned wires contract in different manners when the board is fired. Therefore, warping or distortion of the multilayer board may occur.
Data Source
AI summary
A circuit module includes a multilayer board including an inner-layer ground electrode and an extended electrode that extends from the inner-layer ground electrode in an inner layer thereof, a mounting component mounted on the multilayer board, a resin that covers the mounting component, and a shield electrode that covers the resin and at least a portion of a side surface of the multilayer board. The extended electrode is electrically connected to the inner-layer ground electrode in the multilayer board and at least a portion of the extended electrode overlaps the inner-layer ground electrode when viewed in a lamination direction of the multilayer board. An end portion of the extended electrode is exposed at the side surface of the multilayer board and connected to the shield electrode. An end portion of the inner-layer ground electrode is exposed at the side surface of the multilayer board and connected to the shield electrode.