Multilayer Coil Layout for High-Capacity Low-Profile PCB Mounting

The patent transitions from a planar coil structure to a three-dimensional vertical coil structure by stacking multiple coil patterns on both upper and lower surfaces of a substrate. This dimensional change allows the coil to achieve high capacity through vertical stacking rather than horizontal expansion, resolving the contradiction between increasing number of turns and maintaining low profile.

The patent embeds multiple coil patterns within a compact substrate structure, with first and second coil patterns on the upper surface and third and fourth coil patterns on the lower surface. The coil patterns are nested within the substrate body, allowing high capacity to be achieved within a thin profile by efficiently utilizing the internal space of the substrate.

The patent divides the coil structure into multiple independent coil patterns (first, second, third, and fourth coil patterns) that can be independently designed and configured. Each coil pattern can have different winding axes and geometries, providing design freedom while managing complexity through modular segmentation of the overall coil structure.

The substrate serves multiple functions: it provides mechanical support for the coil patterns, acts as an insulating layer, and enables vertical stacking of multiple coil patterns. This multi-functionality reduces the need for additional separate components, thereby increasing design freedom without proportionally increasing structural complexity.