Multilayer Electronic Component with Recessed Columnar Conductors
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Solution Overview
Problem
The challenge is to reduce the size and height of electronic devices incorporating multilayer electronic components while maintaining reliable electrical connections and mechanical strength, as the thickness of solder and other components interferes with miniaturization efforts.
Innovation Solution
A multilayer electronic component with a ceramic substrate and a resin layer featuring recessed columnar conductors aligned in the thickness direction, where the conductors' end portions are exposed within recesses in the resin layer, allowing for reduced solder thickness and improved bonding strength, and the use of sintered metal conductors integrated with via conductors for enhanced mechanical and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of solder and pad electrodes is increased to ensure reliable electrical connections, then the reliability of electrical connections is improved, but the height of the electronic device increases
Solution Approach 1:
The invention transitions from surface-level connections (pad electrodes on the surface) to subsurface connections (columnar conductors extending vertically into the resin layer). By changing the dimensional approach from horizontal to vertical, the connection reliability is improved without increasing the overall device height, as the conductors utilize the thickness dimension of the resin layer rather than adding external height.
Solution Approach 2:
The columnar conductors are nested within the resin layer, with their end portions positioned inside the resin matrix. This nesting approach allows the conductive elements to be embedded within the existing structure rather than adding external layers, thereby maintaining compact device height while ensuring reliable electrical pathways through the resin material.
2Length of stationary object
If the thickness of solder and pad electrodes is reduced to decrease device height, then the height of the electronic device is reduced, but the reliability of electrical connections deteriorates
Solution Approach 1:
The columnar conductors are pre-formed and positioned within the resin layer before final assembly. This preliminary placement ensures that the conductive pathways are established in advance, providing reliable electrical connections without requiring thick solder layers or large pad electrodes to be added later, thus maintaining compact device height.
Solution Approach 2:
The resin layer acts as an intermediary medium that houses the columnar conductors. Instead of relying on thick external solder and pad structures, the resin provides a matrix that supports and protects the embedded columnar conductors, enabling reliable electrical connections through the intermediate resin medium while maintaining device compactness.
3Reliability
If additional pad electrodes are added to ensure reliable connections, then the reliability of electrical connections is improved, but the device complexity and manufacturing process become more complicated
Solution Approach 1:
The invention merges the functions of pad electrodes and connection conductors into a single integrated structure - the columnar conductors embedded in the resin layer. This consolidation eliminates the need for separate pad electrode fabrication steps, reducing manufacturing complexity while maintaining reliable electrical connections through the unified columnar conductor structure.
Solution Approach 2:
The columnar conductors serve multiple functions simultaneously: they provide electrical conduction, structural support, and connection interfacing between different layers. This multi-functionality replaces the need for dedicated pad electrodes and separate connection elements, simplifying the overall device structure and manufacturing process while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a reduction in the size and height of electronic devices while improving the reliability of electrical connections and mechanical strength, reducing stress concentrations, and simplifying the manufacturing process by allowing for direct bonding of conductors without the need for additional pad electrodes.
Implementation Method 1
The columnar conductor is preferably formed from a sintered metal conductor integrated with a via conductor formed in the ceramic substrate.
Data Source
AI summary
A multilayer electronic component having a ceramic substrate and a resin layer mounted on a mounting substrate. Recess portions are formed at an outside-facing major surface side of the resin layer. In the resin layer, columnar conductors are disposed so that axis line directions thereof are aligned in a thickness direction of the resin layer. End portions of the columnar conductors are located inside the recess portions further from opening faces thereof and have end surfaces exposed in the recess portions. When a multilayer electronic component is mounted on a mounting substrate, solder is provided on the end surfaces of the columnar conductors in the recess portions. The thickness of solder used in the above mounting does not interfere with a reduction in size and height of an electronic device that includes the above multilayer electronic component.