Multilayer Component Outer Contact Thermal Stability
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Solution Overview
Problem
Multilayer components, such as ceramic block capacitors, face challenges in maintaining high current-carrying capacity and thermal stability while minimizing the impact of thermal expansion differences and piezoelectric expansion on fatigue strength, especially at high temperatures.
Innovation Solution
The design incorporates strip-shaped conductor tracks on opposite surfaces of the multilayer component, with a copper/Invar/copper composite sheet and a sintering silver connection layer to ensure thermal stability and mechanical decoupling, allowing for two-dimensional load relief and expansion compensation, thereby reducing the influence of piezoelectric movements on the outer contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid outer contact is used to ensure high current-carrying capacity, then electrical conductivity is improved, but thermal expansion differences and piezoelectric expansion cause fatigue strength to deteriorate
Solution Approach 1:
The outer contact includes a flexible connection layer (sintering silver layer) that allows controlled deformation to accommodate thermal expansion differences between the ceramic main body and the rigid conductor tracks, while maintaining electrical connectivity and reducing fatigue stress
Solution Approach 2:
The outer contact is constructed as a composite structure with rigid conductor tracks (copper/Invar/copper) for current carrying and a flexible sintering silver connection layer for mechanical compliance, combining the advantages of both rigid and flexible materials
2Reliability
If the outer contact is rigidly connected to inner electrodes, then electrical connection is improved, but piezoelectric expansion impairs fatigue strength
Solution Approach 1:
The sintering silver connection layer acts as a flexible intermediary between the rigid conductor tracks and the piezoelectric main body, allowing the connection to maintain electrical continuity while accommodating dimensional changes during piezoelectric expansion
Solution Approach 2:
The sintering silver layer serves as an intermediary element that decouples the rigid conductor tracks from the piezoelectric main body, absorbing mechanical stress while maintaining electrical connection
3Volume of moving object
If conductor tracks are placed close together to reduce size, then device compactness is improved, but thermal expansion differences cause greater stress
Solution Approach 1:
The flexible sintering silver connection layer compensates for thermal expansion stress even when conductor tracks are closely spaced, allowing compact design without proportionally increasing stress concentrations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the multilayer component's current-carrying capacity and thermal stability, maintaining the integrity of the outer contact even under significant thermal and piezoelectric expansions, ensuring minimal degradation from expansion differences.
Implementation Method 1
The main body of the multilayer component has a piezoelectric expansion besides a thermal expansion when a voltage is applied to the inner electrodes
Implementation Method 2
The main body of the multilayer component has a piezoelectric expansion besides a thermal expansion when a voltage is applied to the inner electrodes. The piezoelectric material of the main body usually expands in the stacking direction in which the electrode layers are stacked in the interior of the main body, and contracts in the plane of the inner electrodes
Implementation Method 3
the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body... The first conductor tracks are mechanically decoupled from the second inner electrodes
Data Source
AI summary
A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.