Multilayer Composite Vias for Biological Implants

Solution Overview

Problem

High Temperature Co-fired Ceramic (HTCC) via materials using platinum face challenges due to platinum's catalytic nature, leading to process control difficulties and hermeticity issues, while tungsten vias are not biocompatible, compromising hermeticity and stability in biological environments.

Innovation Solution

A multilayer composite via structure utilizing tungsten and platinum layers, where tungsten provides durability and hermetic stability, and platinum ensures biocompatibility and electrochemical stability, with the option to replace metals with alternatives like palladium or molybdenum for enhanced properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If platinum is used as HTCC via material, then biocompatibility and electrochemical stability are improved, but process control difficulty and hermeticity issues worsen due to catalytic nature

Engineering Contradiction:

ImprovebiocompatibilityVSAvoidprocess control

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The via structure is segmented into multiple functional layers: a first via layer filled with platinum for biocompatibility, a second via layer filled with tungsten for hermeticity, and an intermediate via layer. This segmentation allows each metal to perform its specialized function without the drawbacks of using either metal alone throughout the entire via structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the via structure are assigned different material compositions based on local functional requirements. The platinum is localized to the first via layer where biocompatibility is critical, while tungsten is localized to the second via layer where hermeticity is critical, optimizing the overall performance.

Inventive Principle:

Principle #3Local quality

2Strength

If tungsten is used for HTCC vias, then durability and hermetic stability are improved, but biocompatibility worsens, compromising stability in biological environments

Engineering Contradiction:

ImprovedurabilityVSAvoidbiocompatibility

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The via structure is segmented into multiple functional layers: a first via layer filled with platinum for biocompatibility, a second via layer filled with tungsten for hermeticity, and an intermediate via layer. This segmentation allows each metal to perform its specialized function without the drawbacks of using either metal alone throughout the entire via structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the via structure are assigned different material compositions based on local functional requirements. The platinum is localized to the first via layer where biocompatibility is critical, while tungsten is localized to the second via layer where hermeticity is critical, optimizing the overall performance.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If single-metal via structure is used, then manufacturing simplicity is maintained, but inability to simultaneously achieve hermeticity and biocompatibility worsens

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidhermeticity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The via structure employs a composite material approach by combining multiple metal layers (platinum and tungsten) within a single via. This composite structure enables the simultaneous achievement of hermeticity (provided by tungsten) and biocompatibility (provided by platinum), overcoming the limitations of single-metal via structures.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS10010396B2Multilayer composite materials vias

Publication Date: 2018.07.03 CORTIGENT INC

AI summary

Novel multilayer composite material vias for biological implants are disclosed. The vias comprise two metals, so that the metal more compatible with biological environments is on one end of the via, and the metal more compatible with fabrication of a hermetic package is on the other end of the via.