Multilayer U-Shaped Duplexer Filter for 2 GHz Phase Matching
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Solution Overview
Problem
Existing high-frequency filters and duplexers for mobile communication devices face challenges in achieving optimal performance, downsizing, and cost reduction, particularly at the 2 GHz band, due to inadequate phase matching and increased self-inductance and capacitance issues.
Innovation Solution
The implementation of a filter and duplexer design featuring U-shaped line patterns on multiple layers, where first and second U-shaped patterns overlap to increase self-inductance and allow for easier application of inductors and capacitors, thereby reducing package size and insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple line patterns for phase matching are provided in the circumference of the chip, then phase matching is improved, but the package size becomes larger
Solution Approach 1:
The patent transitions from providing line patterns only on the antenna terminal side to providing them on both antenna terminal and transmitting/receiving terminal sides across multiple layers. This multi-dimensional approach enables effective phase matching without requiring expanded package circumference, thereby resolving the contradiction between phase matching quality and package size.
2Device complexity
If line pattern for phase matching is provided only on the side of antenna terminal, then device complexity is reduced, but filter matching fails in high-frequency duplexer of 2 GHz band
Solution Approach 1:
The patent applies different line pattern configurations to different locations: providing patterns on the antenna terminal side for basic phase matching, and additionally providing patterns on the transmitting and receiving terminal sides for high-frequency impedance control. This localized differentiation enables 2 GHz band filter matching while maintaining reasonable device complexity.
3Volume of stationary object
If self-inductance is increased through overlapping U-shaped line patterns, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements overlapping U-shaped line patterns where the first U-shaped pattern on one layer is positioned to overlap with the second U-shaped pattern on another layer. This nesting arrangement increases self-inductance within a compact footprint, reducing package size while the patterns are designed with sufficient margin to accommodate manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances self-inductance and reduces insertion loss, enabling the creation of smaller, high-performance filters and duplexers that effectively address the limitations of existing technologies at the 2 GHz band.
Implementation Method 1
two U-shaped line patterns are formed to substantially overlap each other. This increases the self-inductance of the line patterns
Implementation Method 2
the impedance matching cannot be improved by the capacitance between the signal line and the ground
Data Source
AI summary
A filter includes a filter chip, a laminated portion on which the filter chip is mounted, an input/output terminal provided in the laminated portion, a first U-shaped line pattern provided on a first layer and coupled to the filter chip, the first layer being included in the laminated portion between the filter chip and the input/output terminal, and a second U-shaped line pattern provided on a second layer to substantially overlap the first U-shaped line pattern and coupled to the first U-shaped line pattern and the input/output terminal, the second layer being included in the laminated portion between the first layer and the input/output terminal.