Multilayer Electrode Composition for Acid-Resistant Cu-Glass Interfaces
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with glass elution in acidic conditions, leading to decreased wettability and density of the external electrode, which affects their reliability and performance.
Innovation Solution
Incorporating Cu particles and glass into the electrode layer, with a portion of the interface between them forming Cu oxides through sintering, to improve wettability and density, thereby enhancing the reliability of the multilayer electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If corrosion-resistant glass is included in the external electrode to prevent erosion by plating solution, then corrosion resistance is improved, but wettability with metal particles decreases, resulting in decreased density of the external electrode
Solution Approach 1:
Cu oxide is introduced as an intermediary substance at the interface between Cu particles and glass. This intermediary layer improves the wettability and bonding between the metal particles and corrosion-resistant glass, allowing the system to achieve both corrosion resistance and high density simultaneously. The Cu oxide forms a transition zone that facilitates better interfacial contact and adhesion.
Solution Approach 2:
The external electrode is designed as a composite material system consisting of Cu particles, glass, and Cu oxide. This composite structure combines the corrosion resistance of glass with the conductivity of Cu particles, while the Cu oxide phase enhances the interfacial bonding between these components, achieving a balance between corrosion resistance and density.
2Reliability
If glass is included in the sintered electrode to prevent erosion, then corrosion resistance is improved, but glass elution occurs in acidic conditions, leading to decreased wettability
Solution Approach 1:
Cu oxide serves as a protective intermediary layer between the glass and the acidic plating solution environment. This intermediary phase reduces the direct interaction between acid and glass, minimizing glass elution while maintaining wettability. The Cu oxide layer acts as a buffer that preserves the interfacial properties under acidic conditions.
Solution Approach 2:
The chemical composition at the interface is modified by introducing Cu oxide, which changes the chemical and physical parameters of the glass-metal interface. This parameter change enhances the stability of the interface under acidic conditions, preventing glass elution and maintaining wettability throughout the plating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The formation of Cu oxides at the interface between Cu particles and glass improves moisture resistance and corrosion resistance, ensuring high reliability and minimizing glass elution, even under acidic conditions.
Implementation Method 1
oxidizing at least a part of the Cu particles to form at least one oxide including Cu at an interface between Cu particles and the glass by sintering
Implementation Method 2
by sintering at a temperature of 650° C. or more and 800° C. or less the body to which the Cu particles and the glass were applied
Data Source
AI summary
A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.