Multilayer Electronic Component Electrode Patterning Without Step Portions
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Solution Overview
Problem
The challenge of manufacturing miniaturized multilayer ceramic capacitors with high capacitance is exacerbated by the difficulty in forming thin dielectric and electrode layers without defects and reliability issues due to step portions, which are difficult to manage in conventional manufacturing methods.
Innovation Solution
The formation of internal electrode patterns through selective laser irradiation to create metal oxides at the end portions of internal electrodes, eliminating the need for conventional photolithography processes and reducing the number of chemical steps, thereby preventing defects and ensuring reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of dielectric layers and internal electrodes is decreased to achieve high capacitance in small size, then the capacitance per volume increases, but the manufacturing difficulty and defect rate increase due to the formation of step portions
Solution Approach 1:
The patent removes the problematic step portions by selectively eliminating metal layers at specific locations using laser irradiation. This extracts the harmful geometric feature (step portion) that causes manufacturing defects while preserving the thin-layer structure needed for high capacitance density.
Solution Approach 2:
The patent changes the physical state of the metal layer from conductive metal to insulating metal oxide through controlled oxidation using laser irradiation. This parameter change (chemical composition and electrical property) eliminates the step portion problem while maintaining the thin-layer architecture for high capacitance.
2Ease of manufacture
If conventional photolithography processes are used to form internal electrode patterns, then the manufacturing process is well-established, but the number of chemical steps increases and reliability decreases due to step portions
Solution Approach 1:
The patent replaces the chemical-based photolithography process with a physical laser irradiation process. This substitution eliminates multiple chemical steps (photoresist coating, exposure, development, etching) while directly forming the desired electrode pattern without creating step portions, thereby improving reliability.
Solution Approach 2:
The patent uses laser-induced oxidation to rapidly convert metal to metal oxide at specific locations. This accelerated oxidation process directly patterns the internal electrodes without requiring conventional photolithography chemical steps, reducing process complexity and eliminating step portion defects.
3Quantity of substance
If the number of dielectric layers and electrode layers is increased to achieve high capacitance, then the capacitance increases, but the manufacturing complexity and difficulty increase
Solution Approach 1:
The patent combines multiple separate manufacturing steps (metal deposition, photoresist coating, exposure, development, etching, photoresist removal) into a single laser irradiation step. This merging dramatically simplifies the manufacturing process while enabling the production of multilayer structures with high capacitance.
Solution Approach 2:
The patent extracts and eliminates the problematic step portions that complicate manufacturing. By removing these geometric discontinuities through selective metal oxidation, the patent simplifies the overall manufacturing process and reduces the complexity associated with handling thin, multi-layered structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of multilayer capacitors with high capacitance and small size by minimizing chemical processes, reducing defects, and enhancing design flexibility while maintaining reliability.
Implementation Method 1
one of end portions of at least one of the internal electrodes is irradiated with a laser for exposure
Implementation Method 2
at least one of the internal electrodes contains a metal oxide at one of end portions of the at least one of the internal electrodes
Data Source
AI summary
A multilayer electronic component and a method of manufacturing the same are disclosed. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and external electrodes disposed on the body and connected to the internal electrodes, wherein at least one of the internal electrodes contains a metal oxide at one of end portions thereof.