Multilayer Electronics Embedding via High-Temp Bonding
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Solution Overview
Problem
Conventional multilayer electronics assembly methods fail to effectively embed discrete electrical circuit components within fusion-bonded modules due to the inability of conventional attachment methods to withstand the temperature and pressure of the fusion bonding process, leading to reduced packaging density and limited electrical connectivity.
Innovation Solution
The use of a bonding material with a reflow temperature higher than the fusion bonding temperature of the substrate layers, such as nanosilver sintered solder or transient liquid phase bonded alloys, allows for the attachment of discrete components at a lower temperature, enabling their integration within the multilayer structure without post-fusion processing steps, and ensuring they remain bonded throughout the fusion bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional attachment methods are used to attach discrete components, then the attachment process is simple and cost-effective, but the bonding material cannot withstand the temperature and pressure of the fusion bonding process, causing components to detach or degrade
Solution Approach 1:
The patent changes the key parameter of bonding material by selecting materials with specific high-temperature properties (melting points above 400°C, glass transition temperatures above 200°C) that can withstand the fusion bonding process conditions, thereby ensuring component attachment reliability during high-temperature lamination
Solution Approach 2:
The patent employs composite bonding materials that combine multiple functional properties: high-temperature stability, adequate strength for component attachment, and compatibility with the lamination process. These composite materials enable both reliable component attachment and successful fusion bonding in a single integrated process
2Volume of moving object
If discrete components are attached before fusion bonding, then components can be embedded within the multilayer structure, but conventional bonding materials fail during the high-temperature fusion bonding process
Solution Approach 1:
The patent changes the temperature parameter threshold by selecting bonding materials with melting points and glass transition temperatures significantly higher than the fusion bonding process temperature, enabling the materials to maintain stability and bonding strength throughout the high-temperature lamination process while allowing component embedding
Solution Approach 2:
The patent performs preliminary component attachment using high-temperature bonding materials before the fusion bonding process, ensuring components are securely embedded in the multilayer structure and will withstand subsequent high-temperature lamination without detaching or degrading
3Reliability
If high-temperature bonding materials are used to attach components, then components remain bonded during fusion bonding, but the attachment temperature must be carefully controlled below component damage thresholds
Solution Approach 1:
The patent changes the temperature parameter by selecting bonding materials with high melting points (above 400°C) and glass transition temperatures (above 200°C), creating a wide safe operating window that allows attachment at temperatures sufficient to bond the materials but well below the fusion bonding temperature, thereby maintaining component integrity while ensuring bonding strength
Solution Approach 2:
The patent provides beforehand cushioning by selecting bonding materials with thermal stability margins that cushion against temperature variations during the attachment process, ensuring that even with temperature fluctuations, the bonding materials remain stable and effective while protecting components from thermal damage
4Ease of manufacture
If conventional bonding processes are used, then the process temperature is low and components are safe, but the bonding material cannot survive the subsequent fusion bonding temperature
Solution Approach 1:
The patent changes the temperature parameter by selecting bonding materials with reflow temperatures (melting points above 400°C, glass transition temperatures above 200°C) that are higher than the fusion bonding temperature, enabling the materials to be applied at moderate temperatures for easy component attachment while surviving the subsequent high-temperature fusion bonding process without reflowing or degrading
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances packaging density and performance by allowing three-dimensional embedding of discrete components, reducing circuit parasitics, and improving electrical connectivity and moisture resistance in high-frequency and power applications.
Implementation Method 1
the bonding material having a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers
Implementation Method 2
multiple layers of fluoropolymer composite substrates that are bonded together into a multilayer structure by utilizing a fusion bonding process
Data Source
AI summary
A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.