Multilayer Electronics Masking Physical Deviations
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Solution Overview
Problem
Multilayer electronic structures often exhibit aesthetic and tactile discontinuities due to deformation and staining at the interface between electronics and surrounding layers, leading to reduced usability and quality perception.
Innovation Solution
A multilayer structure comprising a flexible substrate with embedded electronics, a protective layer of thermoplastic elastomer, and a molded plastic layer that masks physical deviations and surface protrusions, ensuring the protective layer conforms to the substrate's surface profile and reduces visual and tactile imperfections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronics are embedded between surrounding material layers in a multilayer structure, then integration efficiency and component consolidation are improved, but aesthetic quality and surface uniformity deteriorate due to deformation and staining at the interface
Solution Approach 1:
A protective layer is introduced as an intermediary between the electronics and the surrounding material layers. This protective layer prevents direct contact and interaction between the electronics and the molding material, thereby eliminating the staining and deformation issues at the interface while maintaining the embedded structure for integration efficiency.
Solution Approach 2:
The protective layer serves as a pre-established barrier that cushions and protects the electronics from the harmful effects of the molding process. By placing this protective layer beforehand, the electronics are shielded from deformation and staining that would otherwise occur during the embedding process.
2Manufacturing precision
If a protective layer is added to mask physical deviations, then aesthetic quality is improved, but device complexity increases
Solution Approach 1:
The protective layer serves multiple functions simultaneously: it protects the electronics from deformation and staining, masks physical deviations and surface protrusions, and maintains the aesthetic quality of the multilayer structure. By consolidating these multiple functions into a single layer, the increase in device complexity is minimized while achieving comprehensive protection and aesthetic improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively masks visual and tactile discontinuities, enhances the aesthetic and tactile qualities of the multilayer structure, and maintains the structural integrity and functionality of embedded electronics, while being flexible and scalable in manufacturing.
Implementation Method 1
the protective layer comprises elastic material comprising thermoplastic elastomer configured to conform, at the interface between the protective layer and the substrate film, to the local deformations of the surface profile of the substrate film
Implementation Method 2
a plastic layer molded over at least second surface of said substrate film opposite to said first surface, so as to cause physical deviation including deformation therein
Data Source
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AI summary
Multilayer structure (200) for electronic devices, comprising a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to said flexible substrate film, preferably by means of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of said substrate film, said protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of said number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of said substrate film opposite to said first surface. A corresponding method of manufacture is presented.