Multi-layer End Effector for Flexible Substrate Handling

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Solution Overview

Problem

Existing end effectors for holding substrates, such as wafers, are thick and difficult to produce, and struggle to accommodate closely spaced or flexible substrates without damaging them during handling.

Innovation Solution

A thin and lightweight end effector design featuring a main body composed of multiple layers, where at least one layer is not inherently stable, with a fluid channel for vacuum or pressure operation, allowing for reduced thickness and enhanced flexibility in substrate handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional end effector with a milled vacuum channel and cover is used, then the substrate can be held through vacuum technology, but the end effector becomes thick and troublesome to produce

Engineering Contradiction:
Improvesubstrate holding capabilityVSAvoidproduction complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The end effector is divided into multiple separate layers (first layer, second layer, third layer) that are assembled together. The fluid channel is formed by a groove in one layer rather than being milled through the entire component, simplifying manufacturing of individual parts while maintaining vacuum holding capability through the assembled structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple functional layers are combined into a single assembled structure. The first layer provides structural support, the second layer contains the groove for fluid channel formation, and the third layer completes the vacuum seal. This merging of separate simple components achieves the function of a traditionally complex milled component.

Inventive Principle:
Principle #5Merging (Combining)

2Quantity of substance

If wafers are disposed at very small spacing to accommodate maximum number in cartridge, then wafer capacity increases, but the end effector cannot be reliably guided between wafers without damaging them

Engineering Contradiction:
Improvewafer capacityVSAvoiddamage-free handling
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The end effector utilizes thin film structures (particularly the second layer with the groove) that provide flexibility and compliance. This allows the end effector to adapt to closely spaced wafers without rigid contact that would cause damage, while still maintaining effective vacuum engagement for reliable wafer handling.

Inventive Principle:
Principle #30Flexible shells and thin films

3Adaptability or versatility

If the end effector thickness is reduced to handle flexible substrates, then substrate compatibility improves, but the structural stability of the end effector decreases

Engineering Contradiction:
Improvesubstrate compatibilityVSAvoidend effector stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The end effector is constructed as a composite of multiple layers with different properties. The first layer provides structural stability, the second layer with the groove provides fluid channel functionality and flexibility, and the third layer completes the assembly. This composite structure achieves both thinness for substrate compatibility and stability through the combined layers.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The fluid channel is formed by a groove in the second layer rather than by reducing the overall thickness of a solid component. This dimensional approach (creating the channel through a groove rather than by thinning the entire structure) maintains structural stability while achieving the necessary thin profile for handling flexible substrates.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-layer design provides stability and ease of production while enabling reliable handling of substrates with reduced thickness, accommodating closely spaced or flexible substrates without damage, and simplifying assembly and sealing processes.

Implementation Method 1

Suction can be applied to the wafer and it can be held by means of vacuum technology through openings in the cover

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

the end effector is first moved between two wafers in the cartridge and is moved or brought into connection with one of the wafers in order to fix said wafer, e.g. by means of a vacuum or by means of excess pressure using the Bernoulli effect

Methodology Applied
Scientific EffectBernoulli effect: Bernoulli Effect

Data Source

PatentUS10343292B2End effector
Publication Date: 2019.07.09 SUSS MICROTEC LITHOGRAPHY GMBH
  • US10343292B2 patent drawing
  • US10343292B2 patent drawing
  • US10343292B2 patent drawing

AI summary

An end effector for holding substrates has a multi-layered main body and a fluid channel which is provided in the main body. The main body has a receiving end and a fastening end, and include at least two layers, wherein at least one of the layers is not inherently stable, and is formed from a synthetic material film.