Multilayer Film Structure Shielding Electronics From Injection Pressure
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Solution Overview
Problem
Conventional PCB-based structures with LEDs in vehicles face challenges in integration due to space constraints and increased failure rates from direct exposure to injection pressure, necessitating a more robust and compact design.
Innovation Solution
A multilayer structure with films and injection-molding layers is developed, where electrical components are protected from injection pressure, allowing separate testing and assembly, and incorporating touch and lighting functions in a single, flat component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCB-based structures with LEDs are used in vehicles, then integration into installation spaces is attempted, but failure rates increase due to direct exposure to injection pressure
Solution Approach 1:
The patent divides the multilayer structure into distinct segments: a first film with LEDs, a second film with touch-sensitive components, and injection-molding layers. This segmentation isolates the LEDs from direct injection pressure exposure while maintaining integration benefits, thereby reducing failure rates without sacrificing reliability.
Solution Approach 2:
The patent introduces an intermediary air gap between the first and second films, and uses injection-molding layers as protective intermediaries. These intermediaries shield the electrical components from direct exposure to injection pressure during the molding process, preventing damage and reducing failure rates.
2Area of stationary object
If conventional PCB-based structures with light shafts are used, then lighting functions are achieved, but installation space requirements increase
Solution Approach 1:
The patent merges multiple functions into a single integrated multilayer structure: lighting (LEDs on first film), touch sensitivity (components on second film), and structural protection (injection-molding layers). This consolidation eliminates the need for separate light shafts and reduces overall installation space while maintaining functional complexity.
Solution Approach 2:
The patent transitions from conventional 2D PCB layouts to a 3D multilayer configuration with films stacked in multiple layers. This dimensional change allows compact integration of lighting, touch, and structural elements vertically, significantly reducing the horizontal installation space required while managing structural complexity through layered organization.
3Ease of manufacture
If LEDs and conductor tracks are directly exposed to injection pressure, then manufacturing process is simplified, but component reliability decreases
Solution Approach 1:
The patent applies preliminary protective action by bonding the first and second films together and creating the air gap structure before the injection-molding process. This preliminary configuration shields the LEDs and conductor tracks from injection pressure while allowing the molding process to proceed, ensuring component survival without complicating manufacturing.
Data Source
AI summary
An electronically functional multilayer structure having a first film on which first electrical and/or electronic components are arranged on a first film surface and having a second film on which second electrical and/or electronic components are arranged on a first film surface. The two films are arranged on top of each other in such a way that their sides having the respective first film surfaces face each other, there being a gap between the two films in the region of the first and second electrical and/or electronic components.