Multilayer Filter Layout for Low-Coupling Compact Circuits
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Solution Overview
Problem
When components in a filter device are closely arranged to reduce size, electromagnetic coupling can lead to increased signal power loss and deterioration in attenuation characteristics.
Innovation Solution
A filter device design utilizing a multilayer board with different thickness dielectric layers and vias of varying cross-sectional areas to minimize electromagnetic coupling, including a series passive element and parallel wires that connect terminals and a reference electrode, allowing for adjustment of parasitic inductance and capacitance to maintain filter characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are closely arranged to reduce filter size, then device size is reduced, but electromagnetic coupling increases causing signal power loss and deterioration in attenuation characteristics
Solution Approach 1:
The patent applies local quality by making the dielectric layers have different thicknesses (first dielectric layer thickness differs from second dielectric layer thickness) and making the vias have different cross-sectional areas. This creates non-uniform local properties in the electromagnetic field path, which suppresses electromagnetic coupling between closely arranged components while maintaining compact filter size.
Solution Approach 2:
The patent changes physical parameters of the structure by varying dielectric layer thicknesses and via cross-sectional areas. These parameter variations modify the electromagnetic field distribution and coupling characteristics, allowing close component arrangement without excessive signal power loss or attenuation deterioration.
2Volume of moving object
If components are closely arranged to reduce filter size, then device size is reduced, but attenuation characteristics deteriorate
Solution Approach 1:
The different thicknesses of dielectric layers and different cross-sectional areas of vias create localized variations in electromagnetic properties. This local quality differentiation suppresses harmful electromagnetic coupling between closely spaced components, thereby maintaining attenuation characteristics even when filter size is reduced through close component arrangement.
3Reliability
If via cross-sectional areas are made different to suppress electromagnetic coupling, then filter characteristics are maintained, but manufacturing complexity increases
Solution Approach 1:
The patent implements different via cross-sectional areas by varying via dimensions at different locations in the multilayer board. This parameter change approach maintains filter characteristics by suppressing electromagnetic coupling, while the variations can be integrated into standard PCB manufacturing processes, balancing performance requirements with manufacturing feasibility.
Data Source
AI summary
A filter device includes: a multilayer board including a first dielectric layer, a first wiring layer including a reference electrode to which a reference potential is supplied, and a second dielectric layer positioned between the first dielectric layer and the first wiring layer and having a thickness different from a thickness of the first dielectric layer; a series passive element provided on a series wire electrically connecting a first terminal and a second terminal together; a first parallel wire electrically connecting the series wire and the reference electrode together; and a first parallel passive element provided on the first parallel wire. The first parallel wire includes: a first via penetrating through the first dielectric layer and electrically connected to the first parallel passive element; and a second via penetrating through the second dielectric layer and electrically connecting the first via and the reference electrode together.