Multilayer Glass Substrate for High-Density Package Routing
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Solution Overview
Problem
Legacy microelectronic packaging using copper-clad laminate (CCL) substrates faces challenges in achieving high-density, narrow drilling for high-bandwidth communication and integrating components, leading to substrate warpage and limited performance.
Innovation Solution
Employing multiple glass layers with integrated conductive features and laser-assisted etching techniques to create ultra-thin traces and high-aspect ratio through glass vias, allowing for crack-free, high-density via drills and improved package rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If copper clad laminate (CCL) cores are used in legacy microelectronic packaging, then substrate flexibility and ease of manufacture are improved, but substrate warpage increases and manufacturing precision deteriorates
Solution Approach 1:
The patent uses glass layers as a composite material alternative to traditional CCL cores. The glass substrate provides both manufacturability and dimensional stability, eliminating warpage issues while enabling high-precision narrow drilling for high-bandwidth communication applications.
2Ease of manufacture
If copper clad laminate (CCL) cores are used in legacy microelectronic packaging, then substrate flexibility and ease of manufacture are improved, but substrate warpage increases and performance reduces
Solution Approach 1:
The glass layer serves as a high-performance composite material that eliminates substrate warpage and enables integrated components. This improves signal integrity and bandwidth while maintaining ease of manufacture through laser-assisted etching techniques.
3Productivity
If narrow drilling is performed for high-density routing, then signal routing density is improved, but substrate integrity deteriorates and cracking increases
Solution Approach 1:
The patent changes the substrate material parameter from CCL to glass, which has superior mechanical properties. This allows narrow drilling for high-density routing without causing substrate cracking or integrity issues, as glass provides the necessary strength and stability.
4Adaptability or versatility
If integrated components are added to increase functionality, then device versatility is improved, but device complexity increases
Solution Approach 1:
The patent merges the substrate function with component integration by embedding capacitors, inductors, and other passive components directly within the glass layer. This consolidation improves device versatility while managing complexity through integrated design rather than separate assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances package performance by enabling high-density signal routing and reduced warpage, facilitating integration of components within the package core.
Implementation Method 1
laser-assisted etching techniques to create ultra-thin conductive traces and high-aspect ratio through glass vias
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, techniques, or processes for packages that include multiple glass layers within the package. In embodiments, a core of the package may include multiple glass layers that may be bonded together, or may be separated by a dielectric layer between glass layers. In embodiments, the glass layers may include one or more electrically conductive features, such as conductive vias, conductive planes, electrical pads, electrical traces, redistribution layer, capacitors, inductors, active dies and/or passive dies. Other embodiments may be described and/or claimed.