Electronic Device Multilayer Insulation for Edge Moisture Protection
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Solution Overview
Problem
Electronic devices face issues with poor adhesion of multilayer structures and water/oxygen infiltration in the edge areas or around through-holes, affecting their reliability.
Innovation Solution
A multilayer insulating structure is designed with a second insulating layer filled in recesses of a first insulating layer, an adhesive layer with greater thickness than the second insulating layer, and a functional layer, enhancing adhesion and reducing moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a multilayer insulating structure is used, then adhesion between layers is improved, but the structure becomes more complex and manufacturing becomes more difficult
Solution Approach 1:
The insulating structure is divided into multiple layers (first insulating layer, second insulating layer) with the second layer having recesses that create interlocking features. This segmentation improves adhesion between layers while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The second insulating layer has recesses formed at specific locations (edge areas and around through-holes) rather than uniformly across the entire layer. This local modification approach improves adhesion where needed while minimizing the overall structural complexity and manufacturing difficulty.
2Strength
If the adhesive layer thickness is increased to improve adhesion, then bonding strength is enhanced, but the overall device thickness increases
Solution Approach 1:
Recesses are formed in the second insulating layer before applying the adhesive layer. This preliminary structural modification creates mechanical interlocking features that enhance bonding strength, allowing for a thinner adhesive layer while maintaining or improving adhesion performance.
Solution Approach 2:
The structure combines the second insulating layer with recesses and the adhesive layer in a composite configuration. The recesses provide mechanical interlocking while the adhesive provides chemical bonding, creating a composite bonding system that achieves high strength with minimal thickness increase.
3Reliability
If edge areas and through-hole regions are sealed to prevent water and oxygen infiltration, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The sealing function is segmented into specific recess regions at edge areas and around through-holes, rather than requiring uniform sealing across the entire device. This localized approach improves reliability at critical points while reducing overall manufacturing precision requirements.
Solution Approach 2:
Enhanced protection against water and oxygen infiltration is applied locally at vulnerable areas (edges and through-holes) through recess formation, rather than uniformly across the entire insulating layer. This local quality approach improves reliability where needed while maintaining reasonable manufacturing precision standards.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first insulating layer, a second insulating layer, an adhesive layer, and a functional layer. The first insulating layer has a side surface and at least one recess adjacent to the side surface. The second insulating layer is disposed on the first insulating layer and filled in the at least one recess. The adhesive layer is disposed on the second insulating layer. The functional layer is disposed on the adhesive layer. In addition, in a cross-sectional view of the electronic device, the second insulating layer has a thickness at a first position, and a thickness of the adhesive layer corresponding to the first position is greater than the thickness of the second insulating layer.