Multilayer Electronic Component With Lattice Grooves Against Delamination
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in achieving miniaturization and high capacitance while maintaining reliability, as reducing dielectric layer thickness can lead to decreased dielectric breakdown voltage and increased delamination between the ceramic body and external electrodes.
Innovation Solution
The formation of a lattice-type groove shape on the surface of the ceramic body, which enhances interfacial bonding strength with external electrodes, is employed to improve reliability and facilitate miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the dielectric layer is reduced to achieve miniaturization and high capacitance, then the capacitance increases and size decreases, but the dielectric breakdown voltage decreases and reliability deteriorates
Solution Approach 1:
The patent changes the physical and chemical parameters of the dielectric layer by forming a rough surface with increased surface area and controlled pore structure. This parameter change allows the dielectric layer to maintain higher breakdown voltage while achieving miniaturization, as the increased surface area compensates for the reduced thickness without proportionally reducing the breakdown voltage.
Solution Approach 2:
The patent introduces a porous structure in the dielectric layer with controlled pore size and distribution. This porous structure increases the effective surface area and improves the dielectric properties, allowing the layer to maintain high breakdown voltage even at reduced thickness, thus resolving the contradiction between miniaturization and reliability.
2Volume of stationary object
If thin film deposition methods such as sputtering or plating films are used to thin the external electrode, then the volume of non-capacitance portions is minimized and effective volume is maximized, but bonding strength between the ceramic body and external electrode decreases causing delamination
Solution Approach 1:
The patent applies preliminary action by forming a rough surface structure on the dielectric layer before applying the external electrode. This pre-formed surface structure with increased surface area and mechanical interlocking features ensures strong bonding between the ceramic body and external electrode, preventing delamination even when the external electrode is thinned using deposition methods.
Solution Approach 2:
The patent introduces surface curvature and roughness features on the dielectric layer surface. These curved and irregular surface features increase the contact area and mechanical interlocking with the external electrode, enhancing bonding strength while allowing the external electrode to be kept thin for miniaturization.
3Strength
If various pretreatments such as forming surface roughness or applying other materials are performed to facilitate bonding, then bonding between ceramic body and external electrodes is improved, but manufacturing complexity and process steps increase
Solution Approach 1:
The patent merges the surface roughening process with the existing dielectric layer formation process. By integrating the rough surface formation into the dielectric layer fabrication steps rather than adding separate pretreatment processes, the bonding strength is improved without significantly increasing manufacturing complexity or process steps.
Data Source
AI summary
A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.