Multilayer LED Die With Decoupled Thermal Spreading Layer
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Solution Overview
Problem
Existing LED die architectures face performance limitations in one or more essential functions such as current distribution, thermal spreading, and interconnect pad layout, often compromising on other functions like heat-sinking and die interconnection with submount/PCB, which affects brightness and mounting ease.
Innovation Solution
A multilayer structure for light emitting die components with decoupled functional layers, including a thermal spreading layer, dielectric layers, and an interconnect pad, allowing independent optimization of current distribution, thermal spreading, and interconnect pad layout without mutual dependence, enhancing brightness and compatibility with SMD geometries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional LED die architecture is used, then the structure is simple, but the current distribution is non-uniform and thermal spreading is insufficient
Solution Approach 1:
The LED die structure is segmented into multiple functional layers including n-contact layer, p-contact layer, dielectric layer, and thermal spreading layer. Each layer is independently optimized to perform specific functions: current distribution, electrical isolation, and thermal management. This segmentation allows uniform current distribution while maintaining manageable structural complexity through modular design.
2Illumination intensity
If the die structure is optimized for current distribution and thermal spreading, then brightness improves, but the gap distance between electrodes increases
Solution Approach 1:
The patent utilizes vertical layering (z-dimension) to separate functional concerns. The thermal spreading layer and dielectric layers are stacked vertically between the electrodes, allowing horizontal gap distance to be reduced while vertical thickness accommodates the additional functional layers. This dimensional reorganization enables improved brightness through better thermal and current management without excessive increase in electrode gap distance.
3Reliability
If the LED die is mounted on submount with stud-bumps, then electrical contact is achieved, but thermal resistance is high
Solution Approach 1:
A dedicated thermal spreading layer is introduced as an intermediary between the LED die and the submount. This layer has high thermal conductivity and larger surface area, acting as a thermal mediator that efficiently conducts heat away from the active region. The layer is electrically isolated from the electrodes but thermally coupled to the submount, providing improved heat sinking while maintaining electrical contact reliability through the existing stud-bump connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The decoupled multilayer structure improves current uniformity, reduces thermal resistance, and allows larger gap distances between electrodes without compromising thermal performance, resulting in improved brightness and easier mounting of LED dies.
Implementation Method 1
lateral thermal spreading to minimize hot-spots and thermal resistance
Implementation Method 2
a first dielectric layer arranged to electrically isolate said p-contact layer from said n-contact layer
Data Source
AI summary
The present invention relates to a light emitting die component formed by multilayer structures. The light emitting die component comprises a semiconductor structure (103) comprising: an n-type layer (104), an active region (106) and a p-type layer (108); a p-contact layer (110) arranged to be in electrical contact with said p-type layer (108); an n-contact layer (116) arranged to be in electrical contact with said n-type layer (104); a first dielectric layer (114) arranged to electrically isolate said p-contact layer (110) from said n-contact layer (116); a thermal spreading layer (120) comprising a first and a second region (120a, 120b) being electrically isolated from each other, wherein said first region (120a) forming an anode electrode of said light emitting die component and said second region (120b) forming a cathode electrode of said light emitting die component; a second dielectric layer (118) arranged to electrically isolate said n-contact layer (116) from said first region (120a) or to electrically isolate said p-contact layer (110) from said second region (120b); a third dielectric layer (122) arranged to electrically isolate said first and second regions (120a, 120b); and an interconnect pad (124) enabling interconnection with a submount (126).