Multilayer Mass Spectrometry Lid for Vacuum Electrical Feedthroughs
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Solution Overview
Problem
Traditional vacuum feedthroughs in mass spectrometry systems are costly, labor-intensive to install and maintain, and require messy solders and epoxies, posing design challenges for electrical and mechanical connections between atmospheric and vacuum environments.
Innovation Solution
A lid assembly for mass spectrometry systems that includes a substrate with multiple layers, providing electrical and mechanical connections while being free of epoxies and solders, featuring electrically conductive traces and contact elements that can withstand differential pressures, allowing for sealing and supporting components within the vacuum chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vacuum feedthroughs are used for electrical and mechanical connections, then reliable connections between atmospheric and vacuum environments are achieved, but the system becomes costly, labor-intensive to install and maintain, and requires messy solders and epoxies
Solution Approach 1:
The patent combines multiple functions (electrical connection, mechanical support, vacuum sealing) into a single integrated lid assembly. The lid includes conductive traces for electrical connections, contact elements for mechanical support, and sealing surfaces for vacuum integrity, eliminating the need for separate traditional feedthrough components and their associated solders and epoxies.
Solution Approach 2:
The lid assembly serves multiple functions simultaneously: it provides electrical connections through conductive traces, mechanical support through contact elements, vacuum sealing through sealing surfaces, and structural support for the vacuum chamber. This multi-functional design replaces multiple specialized components with a single universal assembly.
2Ease of manufacture
If traditional vacuum feedthroughs with solders and epoxies are used, then electrical connections are established, but the installation and maintenance become labor-intensive and messy
Solution Approach 1:
The patent extracts and eliminates the need for solders and epoxies from the connection process. Instead of using these messy materials to attach components, the design uses mechanical contact elements and conductive traces that are integrated into the lid structure, allowing for cleaner, more reversible assembly and disassembly.
Solution Approach 2:
The patent replaces the traditional mechanical joining methods (soldering, epoxy bonding) with a mechanical contact system. Conductive traces and contact elements make direct electrical and mechanical contact without requiring thermal or chemical bonding processes, simplifying both installation and maintenance.
3Device complexity
If a lid assembly with multiple layers is used to provide electrical and mechanical connections, then the need for traditional feedthroughs is eliminated, but the manufacturing complexity of the multi-layer substrate increases
Solution Approach 1:
The patent adopts the proven manufacturing processes and design methodologies from the printed circuit board industry. The multi-layer substrate with conductive traces is manufactured using standard PCB techniques, allowing manufacturers to leverage existing expertise, equipment, and supply chains rather than developing entirely new manufacturing processes.
Data Source
AI summary
Apparatus, systems, and methods disclosed herein utilize a lid for closing, substantially sealing, and providing an electrical interface for mass spectrometry systems. In various aspects, the present disclosure provides a lid having a plurality of layers with electrical connections therethrough. In some embodiments, lids for use in a mass spectrometry system as are disclosed herein can include a plurality of layers having electrical connections such that their inputs and outputs are laterally staggered across these layers. In some embodiments, the present disclosure provides methods of making and using disclosed lids and mass spectrometry systems. In some embodiments, implementations of the present disclosure are useful in mass spectrometry systems, including, for example, improving and simplifying assembly.