Multilayer Pixel Structure for Single-Transfer RGB LED Alignment
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Solution Overview
Problem
The existing light emitting diode (LED) display panels face challenges in improving yield, cost, and resolution due to the complexity and accuracy required in transposing multiple color LED elements onto a driving back plate, which limits their efficiency and performance.
Innovation Solution
A pixel structure is designed with multiple semiconductor layers and active layers, along with an electrode layer, that allows for the simultaneous formation and transposition of multiple color LED elements on the same growth substrate, reducing the need for multiple transposing actions and enhancing resolution by ensuring equal spacing and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple color LED elements are formed using three separate growth substrates and transposed onto the driving back plate using multiple transposing actions, then each color LED element can be independently formed, but the manufacturing complexity increases and the yield and resolution are difficult to improve
Solution Approach 1:
The patent merges multiple color LED element formation processes into a single growth substrate. Multiple semiconductor layers (first, second, third semiconductor layers) and active layers are formed on the same substrate, allowing simultaneous growth of different color LED elements (red, green, blue) without requiring separate substrates and multiple transposing operations. This integration directly reduces manufacturing complexity while maintaining the ability to independently form each color element.
Solution Approach 2:
The patent segments the single growth substrate into multiple functional regions, each containing different semiconductor layers and active layers for different colors. The substrate is divided into first, second, and third regions with respective semiconductor layers and active layers that can be independently controlled and formed, allowing multi-color LED elements to coexist on one substrate without interfering with each other's formation.
2Measurement precision
If multiple transposing actions are used to transfer LED elements onto the driving back plate, then color-specific LED elements can be positioned, but transposition errors increase and alignment precision decreases
Solution Approach 1:
The patent combines all LED element formation and positioning operations into a single substrate processing step. By forming all semiconductor layers and active layers on one growth substrate before any transposition, the patent eliminates multiple separate transposing actions. The entire multi-color LED structure is transferred as a single integrated unit, ensuring precise alignment and eliminating cumulative positioning errors that would result from multiple transposition steps.
3Adaptability or versatility
If three separate growth substrates are used to form red, green, and blue LED elements, then each color can be optimized independently, but the cost and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by creating distinct regions within the single growth substrate, where each region has optimized semiconductor layers and active layers for a specific color. The first semiconductor layer with first active layer is optimized for red, the second for green, and the third for blue. Each local region maintains its color-specific optimization while all regions coexist on the same substrate, eliminating the need for three separate substrates.
Data Source
AI summary
A pixel structure, including a first semiconductor layer, a first active layer, a second semiconductor layer, a second active layer, a third semiconductor layer, and an electrode layer that are sequentially stacked, is provided. A first portion of the electrode layer is electrically connected to a first portion of the first semiconductor layer through a first opening of a first portion of the third semiconductor layer, a first opening of a first portion of the second active layer, a first opening of a first portion of the second semiconductor layer, and a first opening of a first portion of the first active layer. A second portion of the electrode layer is electrically connected to a second portion of the second semiconductor layer through a second opening of a second portion of the third semiconductor layer and a second opening of a second portion of the second active layer.