Multilayer Photopolymerizable Resin with Barrier Layer for Display Patterning
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Solution Overview
Problem
Existing photopolymerizable resin compositions for display devices face challenges in achieving precise patterning due to interference between layers with different etching rates and materials, leading to inaccurate pattern formation and reduced precision.
Innovation Solution
A photopolymerizable resin composition with a multilayer structure, including a barrier layer of SiNx, SiOx, SiON, Mo oxide, Cu, Cu oxide, Al, Al oxide, Ag, or Ag oxide, which separates the first and second layers, allowing for controlled etching rates and accurate pattern formation by acting as a barrier between layers with different materials or etching characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple layers with different etching rates are used to form complex patterns, then patterning capability is improved, but interference between layers causes inaccurate pattern formation
Solution Approach 1:
An intermediate layer is introduced between the first and second layers with an etching rate that is intermediate between the two layers. This intermediate layer acts as a mediator that prevents direct interference between the layers with different etching rates, allowing each layer to be etched at its intended rate without disrupting the other layers, thereby maintaining both the versatility of multi-layer patterning and the precision of pattern formation
Solution Approach 2:
The patent uses a composite multi-layer structure where each layer is made of different materials with distinct etching characteristics. The first layer, intermediate layer, and second layer are composed of different photopolymerizable resin materials that exhibit different etching rates, allowing selective etching while maintaining structural integrity and pattern accuracy through the composite architecture
2Adaptability or versatility
If layers with different materials are combined to achieve complex functionality, then device functionality is improved, but layer interference reduces patterning precision
Solution Approach 1:
The intermediate layer serves as a mediator between layers with different materials and etching characteristics. It has an etching rate that is intermediate between the first and second layers, which allows it to buffer the interference effects between layers with different materials, thereby maintaining both the functional versatility of using different materials and the precision of patterning
Solution Approach 2:
Each layer in the composite structure is designed with specific local properties - the first layer has specific etching characteristics, the intermediate layer has intermediate etching characteristics, and the second layer has different etching characteristics. This local differentiation of properties allows each layer to perform its specific function while the intermediate layer prevents interference, maintaining both functionality and precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The barrier layer enables precise control over etching rates, resulting in improved patterning accuracy and reduced interference between layers, enhancing the formation of complex patterns suitable for display devices such as semiconductor layers, electrodes, and spacers.
Implementation Method 1
a barrier layer disposed between the first layer and the second layer, wherein the barrier layer includes one or more of SiNx, SiOx, SiON, Mo, a Mo oxide, Cu, a Cu oxide, Al, an Al oxide, Ag, and a Ag oxide
Implementation Method 2
The coated photopolymerizable resin composition is exposed and developed under a predetermined-shaped mask such that a desired pattern may be formed
Data Source
AI summary
A photopolymerizable resin composition includes a first layer and a second layer; and a barrier layer disposed between the first layer and the second layer, the barrier layer includes one or more of SiNx, SiOx, SiON, Mo, a Mo oxide, Cu, a Cu oxide, Al, an Al oxide, Ag, and a Ag oxide.