Multilayer Resin Substrate Concave Portion Cutting Method

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Solution Overview

Problem

Conventional multilayer resin substrates with concave portions experience interlayer peeling due to scattered resin pieces attaching to the conductor pattern during the cutting process, leading to lower bonding strength and increased risk of delamination.

Innovation Solution

The multilayer resin substrate design includes a concave portion formed by cutting an opening from one surface of the resin layer, preventing the scattered pieces from contacting the conductor pattern, thus reducing interlayer peeling by maintaining the scattered pieces on the opposite surface during bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a cutting process is performed from the opposite surface to form openings, then the openings can be formed efficiently, but scattered resin pieces attach to the conductor pattern causing interlayer peeling and reduced bonding strength

Engineering Contradiction:

Improveopening formation efficiencyVSAvoidbonding strength

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent inverts the conventional cutting approach by performing the cutting process from the same surface where the conductor pattern is located, rather than from the opposite surface. This inversion prevents scattered resin pieces from falling onto and adhering to the conductor pattern, thereby eliminating the cause of interlayer peeling while maintaining efficient opening formation

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent converts the harmful effect of scattered resin pieces into a beneficial outcome by controlling their deposition location. The scattered pieces are intentionally allowed to attach only to the resin layer surface away from the conductor pattern, where they do not interfere with electrical connections or bonding quality, thus transforming a potential defect into a non-critical feature

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Ease of manufacture

If scattered pieces are attached to the bonded surface between resin layers, then the bonding strength of the bonded surface is reduced, but the cutting process remains simple

Engineering Contradiction:

Improvecutting process simplicityVSAvoidbonding strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies local quality by creating a spatial distinction in the resin layer: the region near the conductor pattern maintains high bonding strength free of scattered pieces, while the region away from the conductor pattern accepts scattered piece deposition. This localized differentiation ensures that critical bonding areas remain strong while non-critical areas can accommodate manufacturing byproducts

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If the end portion of the opening contacts the conductor pattern, then the opening is properly formed, but interlayer peeling occurs due to scattered pieces

Engineering Contradiction:

Improveopening formation precisionVSAvoidinterlayer peeling resistance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent employs preliminary action by pre-positioning the opening formation process to start from the conductor pattern side and progress inward, ensuring that the opening is created with precise control over its boundaries. This preliminary positioning ensures that the opening end portion does not extend beyond the intended location where it would contact the conductor pattern and cause peeling

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces or prevents interlayer peeling at the concave portion, enhancing the bonding strength and reliability of the multilayer resin substrate.

Implementation Method 1

heating and pressing a plurality of resin layers including the resin layer including the opening

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

heating and pressing a plurality of resin layers including the resin layer including the opening

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS11963294B2Multilayer resin substrate, and method of manufacturing multilayer resin substrate

Publication Date: 2024.04.16 MURATA MFG CO LTD

AI summary

A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.