Multilayer Resonator Stack Layout for Branch Filter Isolation
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Solution Overview
Problem
Miniaturization of branching filters for compact mobile communication devices leads to degraded isolation between different frequency bands, affecting the performance of multilayer electronic components.
Innovation Solution
A multilayer electronic component design featuring a stack of dielectric and conductor layers with specific through hole configurations, including first and second through hole lines connected in series, and a conductor layer portion connecting these lines, with the second through hole line positioned between the conductor layer and ground, effectively dividing the component into regions to ensure isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the branching filter is reduced in size through miniaturization, then the footprint and size of the device are reduced, but the isolation between the first filter and the second filter is degraded
Solution Approach 1:
The patent divides the stack into multiple regions (first region and second region) separated by second through hole lines. This segmentation creates isolated zones for different filter circuits, preventing electromagnetic interference while maintaining a compact overall structure. The through hole lines act as partitioning elements that segment the limited space into functionally independent regions.
Solution Approach 2:
The patent applies different structural characteristics to different parts of the stack. Specifically, first through hole lines are configured for resonator connections while second through hole lines are configured for ground connections and region separation. This local differentiation of through hole functions optimizes both the resonant performance and the isolation performance in their respective locations without requiring overall structural changes.
2Area of stationary object
If the branching filter is miniaturized using stacked dielectric and conductor layers, then the device footprint is reduced, but electromagnetic isolation between different frequency bands deteriorates
Solution Approach 1:
The second through hole lines filled with conductive paste serve as intermediary ground connections between the first and second regions. These intermediary ground paths provide electromagnetic shielding and reference potential between the different frequency band circuits, preventing harmful electromagnetic coupling while the compact stacked structure maintains small footprint.
Solution Approach 2:
The patent utilizes the vertical stacking dimension to achieve isolation that would be difficult to obtain in planar layouts. By arranging filter circuits in different layers and using through holes to connect and separate them vertically, the patent achieves electromagnetic isolation in the stacking direction while maintaining a small planar footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures isolation between different regions, maintaining performance even in miniaturized forms, thus addressing the issue of degraded isolation in compact communication devices.
Implementation Method 1
a band-pass filter including a plurality of resonators configured to electromagnetically coupled with each other
Implementation Method 2
Each of the plurality of resonators includes a first through hole line, a second through hole line, and a conductor layer portion connecting the first through hole line and the second through hole line
Data Source
AI summary
An electronic component includes a plurality of resonators and a stack. Each of the plurality of resonators includes a first through hole line, a second through hole line, and a conductor layer portion. The second through hole line is provided between the conductor layer portion and ground in a circuit configuration. The stack includes a first region and a second region. The first region and the second region are divided by a plurality of second through hole lines.