Two coupled planar bifilar lines and matching networks widen balun bandwidth while correcting phase and amplitude imbalance at microwave frequencies.
A stacked passive filter with ground plane, conductive patches, and vias suppresses EMI while improving signal integrity and heat dissipation.
Distributed capacitive taps replace bulky RF splitters and couplers, enabling compact low-loss signal distribution and aggregation in RFICs.
A reactive tuning element and sampled RF feedback let the combiner extend frequency range while minimizing reflected power and insertion loss.
Diode-switched capacitor segments let an RF matching circuit retune during plasma changes, cutting reflected power and stabilizing semiconductor processing.
A laminated busbar integrates inductors, capacitors, and current sensing to cut interfaces, save installation space, and improve EMC.
Overlapping branched metal layers with a shared ground plane shrink mmWave MIMO combiner area while improving isolation and reducing cross-talk.
A center-tapped inductor shared across resonant circuits boosts filter order and sharp out-of-band rejection without added circuit area.
Golden-load calibration creates correction factors for each match network, keeping plasma power delivery consistent across tools.
A vertically coupled transmission line transformer raises impedance transformation ratio in a compact matching circuit while keeping insertion loss low.
A dual tuning network decouples inverter and coil currents to handle K-coefficient variation while cutting loss and EMI.
Rapid EVC-based impedance matching detects plasma chamber changes, cutting tuning time and reducing mechanical stress in RF semiconductor tools.
Ground vias replace costly inductors in an RF low-pass filter, preserving harmonic suppression while reducing component area and cost.
Rotating the resonator against a dielectric-supported coupling line tunes RF cavity filters while reducing PIM and tolerance drift.
A low-pass filter separates RF and DC test paths so relay contact wear does not degrade DC accuracy or cause signal interference.
Phase-shifted bias RF control and matching circuits cut reflected waves, improving impedance matching and power efficiency in plasma processing.
A two-stage plasma filter uses air-core and core coils to block frequency-specific power leakage and reduce loss to the power supply.
Inner and outer curvature tuning aligns the resonator with the magnetic field to cut resistance and improve wireless power transfer.
Matching LC temperature dependence keeps common-mode noise suppression stable as resonance shifts, avoiding extra temperature control hardware.
A split core places capacitors between opposed core bodies to cancel magnetic field impact and preserve noise attenuation in compact filters.
Through-hole region separation in a multilayer resonator stack preserves isolation between frequency bands as branching filters are miniaturized.
A winding sub-line layout balances positional shifts during manufacturing, keeping directional coupler coupling stable in a compact multilayer body.
Notched supports hold helical inductor turns at even gaps to improve inductance consistency, vibration resistance, and defrosting power transfer.