Multi-Layer SiP Additive Assembly for Flexible Series Production

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Solution Overview

Problem

Current SiP manufacturing methods require expensive and inflexible facilities, making it difficult to adapt for producing different types of SiPs or electronic components, especially for series production of thousands of parts.

Innovation Solution

A method for manufacturing a system in a multi-layer package using additive manufacturing techniques, where each layer involves creating a dielectric substrate, depositing electronic components and interconnections, and encapsulating with filler material, all within a single, versatile manufacturing installation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional SiP manufacturing methods are used, then manufacturing precision and reliability are maintained, but device complexity and cost increase significantly

Engineering Contradiction:

Improvemanufacturing reliabilityVSAvoidfacility complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a single manufacturing installation that can produce multiple types of SiP and electronic components through reconfigurable tooling and programming, eliminating the need for separate specialized facilities for different component types while maintaining manufacturing reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the manufacturing process into modular steps (substrate preparation, component placement, interconnection, encapsulation) that can be independently controlled and reconfigured, allowing the same installation to handle different SiP types by changing process parameters rather than physical equipment

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If traditional manufacturing facilities are used, then manufacturing precision is maintained, but adaptability to different SiP types decreases

Engineering Contradiction:

Improveassembly precisionVSAvoidSiP type adaptability

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamics by making the manufacturing installation reconfigurable through programmable robot arms, adjustable tooling fixtures, and software-controlled process parameters, enabling the same physical equipment to adapt to different SiP geometries, sizes, and component configurations while maintaining precision through controlled parameter adjustment

Inventive Principle:

Principle #15Dynamics

3Reliability

If specialized manufacturing facilities are used, then product quality is ensured, but productivity for series production decreases

Engineering Contradiction:

Improveproduct qualityVSAvoidseries production efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent applies universality by creating a single multi-functional installation that can produce various SiP types in one continuous process flow, eliminating the need to switch between specialized facilities and enabling high-volume series production of different component types without retooling downtime

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the production of various SiPs without changing the manufacturing setup, significantly reducing unit costs and enabling efficient series production.

Implementation Method 1

making a dielectric substrate by an additive manufacturing technique, the substrate comprising a receiving surface, the receiving surface comprising receiving zones configured to receive electronic components

Methodology Applied

Scientific EffectAdditive manufacturing: 3D Printing

Implementation Method 2

depositing an adhesive in the receiving zones

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 3

depositing electronic components in the corresponding receiving zones; depositing the electronic components is carried out by a deposition head

Methodology Applied

Scientific EffectMechanical deposition: Deposition (physical)

Implementation Method 4

depositing interconnection elements between the electronic components

Methodology Applied

Scientific EffectConductive deposition: Deposition (physical)

Implementation Method 5

encapsulating the current layer with filler material, the filler material forming an outer surface

Methodology Applied

Scientific EffectEncapsulation: Physical Containment

Data Source

PatentUS20250038121A1Manufacturing method of a system in package having several layers and associated manufacturing installation

Publication Date: 2025.01.30 THALES SA

AI summary

The present invention relates to a method for manufacturing a system in package having several layers, including for each current layer realization of a dielectric substrate by an additive manufacturing technique, deposition of an adhesive in receiving zones, deposition of electronic components in the corresponding receiving zones, deposition of interconnection elements between the electronic components, creation of at least one interconnection with an adjacent layer, encapsulation of the current layer with filler material, the filler material forming an outer surface, and preparation of the outer surface for receiving the next layer.