Multilayer Substrate Layout for Bonding Deformation Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer substrates face issues with deformation and short circuits during thermal pressure bonding due to uneven thickness distribution, leading to weakened structural integrity in areas with cavities.
Innovation Solution
A multilayer substrate design with distinct regions of varying conductor layer thicknesses, particularly in the positive and intermediate regions, enhances structural strength by distributing stress more evenly, reducing deformation and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a cavity is provided in the multilayer substrate for mounting electronic components, then the functionality of the substrate is improved, but the strength of the substrate is reduced leading to deformation during thermal pressure bonding
Solution Approach 1:
The patent applies local quality by varying the thickness of conductor layers based on their position in the substrate. Specifically, conductor layers in the positive region (closer to the cavity) are made thicker than those in the intermediate region, providing localized reinforcement where it is most needed to prevent deformation during bonding while maintaining overall substrate functionality.
2Strength
If the thickness of conductor layers is increased to prevent deformation, then the strength of the substrate is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent segments the substrate into three distinct regions along the Z-axis: positive region, intermediate region, and negative region. This segmentation allows for differentiated conductor layer thicknesses in each region, optimizing strength where needed while simplifying manufacturing by providing clear regional guidelines for production.
3Stability of the object's composition
If the multilayer substrate is divided into three regions with different conductor layer thicknesses, then the deformation resistance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-defining the three regional zones and their corresponding conductor layer thickness requirements before the actual manufacturing process. This advance planning establishes clear specifications for each region, enabling manufacturers to prepare appropriate materials and processes in advance, thereby reducing the actual manufacturing precision burden during production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents deformation and short circuits by maintaining structural integrity, particularly around cavities, through strategic conductor layer thickness variations.
Implementation Method 1
The second multilayer body is fixed to the first multilayer body by bonding one of the plurality of first insulator layers to one of the plurality of second insulator layers
Data Source
AI summary
In a multilayer substrate, a second multilayer body is positioned in a positive direction of a Z-axis of a first multilayer body. The second multilayer body is fixed to the first multilayer body via a first insulator layer bonded to a second insulator layer. Regions obtained by dividing the first multilayer body into three equal portions in the Z-axis direction are defined as a positive region, an intermediate region, and a negative region. A portion of one or more positive region first conductor layers is located in the positive region. An entirety of one or more intermediate region first conductor layers is located in the intermediate region. A thickness in the Z-axis direction of at least one of the one or more positive region first conductor layers is larger than the thickness in the Z-axis direction of the one or more intermediate region first conductor layers.