Multilayer Substrate Coil Inductance Measurement Precision
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer substrates with coil conductors face challenges in accurately detecting electrical short circuits due to minimal changes in inductance measurements, making it difficult to identify defective products during manufacturing.
Innovation Solution
The multilayer substrate design includes a configuration where the first and second coil conductors are directly connected to external electrodes without an intervening coil conductor, enhancing the change in inductance measurement when a short circuit occurs, allowing for accurate detection of electrical short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If coil conductors are arranged in series with intervening coil conductors between first and second coil conductors, then the circuit functionality is maintained, but the inductance change measurement precision deteriorates making short circuit detection difficult
Solution Approach 1:
The patent extracts the measurement function from the intermediate coil conductors by removing them from the signal path between first and second coil conductors. This allows direct measurement of inductance change between the outer coil conductors, improving measurement precision for short circuit detection while maintaining the series connection of all coil conductors for circuit functionality
Solution Approach 2:
The patent introduces external electrodes as intermediary measurement points that directly contact the first and second coil conductors. These external electrodes serve as mediators for inductance measurement, enabling precise detection of short circuits without being affected by intermediate coil conductors in the series arrangement
2Volume of moving object
If insulating base material is thinned for miniaturization, then the substrate size is reduced, but electrical short circuit risk increases at thin points during hot pressing
Solution Approach 1:
The patent performs preliminary arrangement of coil conductors on different surfaces (first surface, second surface, and lateral surface) before hot pressing. This preliminary spatial distribution ensures that even with thinned insulating material, the coil conductors are positioned where short circuits are less likely to occur, maintaining reliability while enabling miniaturization
Solution Approach 2:
The patent transitions from planar arrangement to three-dimensional arrangement by placing coil conductors on multiple surfaces including the lateral surface of the insulating base material. This dimensional change allows efficient use of space for miniaturization while maintaining adequate insulation distance to prevent short circuits
3Measurement precision
If coil conductors are directly connected without intervening coil conductors, then short circuit detection precision is improved, but the circuit path becomes simpler potentially reducing functionality
Solution Approach 1:
The patent segments the coil conductor system into functionally independent units: a series-connected chain of coil conductors (first, third, fourth, fifth coil conductors) for circuit functionality, and separate measurement points (second coil conductor with external electrodes) for detection. This segmentation allows direct measurement between first and second coil conductors for high precision short circuit detection while maintaining the series connection of other coil conductors for circuit adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise detection of electrical short circuits, facilitating the identification of defective products during the inspection process by increasing the change in inductance measurement between external electrodes.
Implementation Method 1
the insulating base materials are laminated and collectively hot pressed
Implementation Method 2
a plurality of insulating base materials having thermoplasticity that are laminated together
Data Source
AI summary
A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.