Multilayer Substrate Integrating Driver IC and Coil for Magnetic Sensor Noise Reduction
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Solution Overview
Problem
Conventional actuators with a coil, driver IC, and magnetic sensor experience variations in magnetic field characteristics due to shifting mounting positions, leading to noise interference and inaccurate magnet position detection.
Innovation Solution
A multilayer substrate with a stacked body of insulating base material layers, a driver IC, and a coil, where the coil ends are electrically connected to mounting electrodes through conductive bonding material at a single position, reducing positional shifts and noise interference by symmetrically disposing magnetic sensors to cancel noise components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the coil and driver IC are separately mounted to the substrate, then the mounting flexibility is improved, but the mounting position shifts causing magnetic field variations
Solution Approach 1:
The patent merges the coil and driver IC into a single integrated unit where the driver IC is mounted on the same substrate as the coil with fixed positional relationships. This integration eliminates the separate mounting process that causes position shifts, while still allowing design flexibility in the integrated unit's configuration and placement on the final substrate.
Solution Approach 2:
The driver IC and coil are pre-assembled into a fixed configuration on a substrate before being mounted as a complete unit. This preliminary assembly establishes precise positional relationships between components, eliminating the need for separate mounting operations that would otherwise cause position variations.
2Ease of operation
If the driver IC is connected to the magnetic sensor through wiring, then the control function is improved, but the wiring generates magnetic field noise interfering with the sensor
Solution Approach 1:
The patent extracts the high-current power wiring that causes magnetic field noise from the vicinity of the magnetic sensor. The driver IC is positioned and wired such that the high-current paths are separated from the low-current sensor signal paths, removing the harmful magnetic field interference from the sensor's operational environment while maintaining full control functionality.
Solution Approach 2:
Different regions of the substrate are assigned different functional qualities: the driver IC region handles high-current power delivery with appropriate trace widths and shielding, while the magnetic sensor region maintains low-noise characteristics with narrow signal traces and optimized grounding. This local differentiation minimizes magnetic field noise in the sensor area while preserving control functionality.
3Adaptability or versatility
If the driver IC mounting position shifts, then the assembly flexibility is improved, but the magnetic field characteristics vary causing detection inaccuracies
Solution Approach 1:
The driver IC and coil are merged into a fixed integrated assembly where their relative positions are predetermined. This integration ensures that the magnetic field characteristics remain consistent regardless of where the complete assembly is placed on the final substrate, as the internal geometry that determines field characteristics is locked in place during integration.
Solution Approach 2:
The precise positional relationship between the driver IC and coil is established in advance during the integration process. This preliminary positioning ensures that magnetic field characteristics are optimized and consistent, eliminating variations that would otherwise occur due to mounting position shifts in separately assembled components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces variations in magnetic fields, improves the accuracy of magnet position detection by minimizing noise interference and stabilizing the positional relationship between the driver IC and coil.
Implementation Method 1
an actuator including a coil, a driver IC, and a magnetic sensor that are driven by electromagnetic power
Implementation Method 2
a coil provided in the stacked body and including a first end and a second end, each of which is electrically connected to one of the plurality of mounting electrodes through a conductive bonding material
Data Source
AI summary
A multilayer substrate includes a stacked body obtained by stacking a plurality of insulating base material layers, a driver IC including a plurality of mounting electrodes, coils, and magnetic sensors. The driver IC and the magnetic sensors are mounted to the stacked body. The coils include a first end and a second end that are electrically connected to the driver IC through a conductive bonding material. The first end and a mounting electrode are connected at one position through the conductive bonding material.