Cracked High-Resistance Layer in Multilayer Varistors

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Multilayer varistors face the challenge of insulation failure due to the migration of ionized metal between electrodes when applied with voltage in a high-humidity environment.

Innovation Solution

A multilayer varistor design featuring a sintered body with internal and external electrodes, and a high-resistance layer with a surface having a plurality of cracks, which increases the creepage distance between electrodes and acts as a migration barrier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a high-resistance layer is formed to cover the sintered body surface, then insulation performance is improved, but metal ion migration still occurs in high-humidity environments

Engineering Contradiction:
Improveinsulation performanceVSAvoidmetal ion migration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The high-resistance layer is designed with a cracked surface structure that creates a porous configuration. These cracks increase the surface path length for metal ion migration, effectively blocking the harmful migration path while maintaining the insulating function of the layer.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The solution transitions from a flat, two-dimensional surface coating to a three-dimensional cracked surface structure. The cracks create additional surface area and extend the migration path in the horizontal dimension, preventing direct vertical migration between electrodes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the high-resistance layer is made thicker to improve insulation, then insulation performance is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveinsulation performanceVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of increasing the thickness parameter of the high-resistance layer, the invention changes the surface morphology parameter by introducing cracks. This parameter substitution achieves improved insulation performance without the drawbacks of increased thickness, such as longer processing times and higher manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The increased creepage distance and the presence of cracks in the high-resistance layer effectively suppress the migration of metal ions, preventing insulation failure and ensuring reliable operation in high-humidity conditions.

Implementation Method 1

the high-resistance layer has a surface having a plurality of cracks... effectively suppress the migration of metal ions

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS12334235B2Multilayer varistor
Publication Date: 2025.06.17 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US12334235B2 patent drawing
  • US12334235B2 patent drawing
  • US12334235B2 patent drawing

AI summary

A multilayer varistor of the present disclosure includes a sintered body, a first internal electrode, a second internal electrode, a first external electrode, a second external electrode, and a high-resistance layer. The first internal electrode and the second internal electrode are disposed in the sintered body. The first external electrode is disposed on a surface of the sintered body and is electrically connected to the first internal electrode. The second external electrode is disposed on the surface of the sintered body and is electrically connected to the second internal electrode. The high-resistance layer covers at least part of the surface of the sintered body, and the high-resistance layer has a surface having a plurality of cracks.