Multilayer Wiring Board Structure for Interface-Free Insulation
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Solution Overview
Problem
Current multilayer wiring boards face challenges in achieving excellent insulation reliability due to internal interfaces and metal diffusion issues, which affect their performance and longevity.
Innovation Solution
A multilayer wiring board design featuring integrally formed insulating resin layers without internal interfaces, combined with inorganic insulating layers and metal-containing layers that prevent metal diffusion, enhances insulation reliability and adhesion between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple insulating resin layers are laminated together to form multilayer wiring structure, then wiring complexity and functionality are improved, but internal interfaces are created that reduce insulation reliability
Solution Approach 1:
The patent applies the merging principle by integrating multiple insulating resin layers into a single integrally formed insulating resin layer. This eliminates the internal interfaces that would normally exist between laminated layers, thereby preventing delamination while maintaining the multilayer wiring structure's functionality and complexity.
Solution Approach 2:
The patent employs composite materials by combining the integrally formed insulating resin layer with inorganic insulating layers and metal-containing layers. This composite structure provides both the insulation properties needed for multilayer wiring and the adhesion strength required to prevent delamination at interfaces.
2Ease of manufacture
If conventional lamination method is used to form multilayer structure, then manufacturing process is simplified, but metal diffusion occurs at interfaces reducing insulation reliability
Solution Approach 1:
The patent introduces metal-containing layers as intermediary barriers between the insulating resin layer and conductor layers. These intermediary layers prevent metal diffusion across interfaces while being integrated into the manufacturing process through sequential layer formation.
Solution Approach 2:
The patent creates a composite structure combining insulating resin layers with inorganic insulating layers and metal-containing layers. This composite approach maintains manufacturing simplicity while preventing metal diffusion that would otherwise occur at conventional lamination interfaces.
3Reliability
If integrally formed insulating resin layer is used, then insulation reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the manufacturing process into distinct sequential steps: forming the integrally formed insulating resin layer, depositing inorganic insulating layers, and adding metal-containing layers. This segmentation allows each layer to be formed with precise control, reducing overall manufacturing precision requirements despite the complexity of creating an integral structure.
Data Source
AI summary
A multilayer wiring board includes two or more layers laminated together, each layer includes an insulating resin layer having a first surface and a second surface, and a conductor layer. The insulating resin layer includes a first recess that is open to the first surface, a groove section that is open to the first surface, and a second recess that is open to the second surface and communicates with one or more of the first recesses. Each insulating resin layer is integrally formed in a thickness direction thereof. The conductor layer includes a land portion and a wiring portion filling the first recess and the groove section, and a via portion protruding from the first surface at a position of the land portion. The via portion protruding from the first surface of the insulating resin layer fills a recess of another insulating resin layer adjacent to the first surface.