Multisolvent Thinner Composition for Uniform Photoresist Films
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Solution Overview
Problem
Existing thinner compositions used in semiconductor and display device manufacturing fail to achieve uniform thickness of photosensitive films due to issues with dissolution rates, volatility, and edge bead formation, leading to equipment damage and reduced yield.
Innovation Solution
A thinner composition comprising a multifunctional carboxylic acid compound and organic solvents with different dielectric constants is used to improve film uniformity by enhancing compatibility and edge bead removal, reducing the amount of photoresist required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the dissolution rate of the thinner composition is excessively high, then the photosensitive film can be removed quickly, but attack for the photosensitive film occurs during rinse
Solution Approach 1:
The patent adjusts the chemical composition parameters of the thinner by incorporating specific organic solvents (ether alcohol, ester, ketone) in controlled proportions to moderate the dissolution rate, preventing excessive attack on the photosensitive film while maintaining effective removal capability
Solution Approach 2:
The thinner composition uses a composite formulation combining multiple types of organic solvents (ether alcohol, ester, ketone) with a multifunctional carboxylic acid compound to achieve balanced dissolution properties that remove concentrated photoresist without damaging the main film
2Object-affected harmful factors
If the dissolution rate of the thinner composition is excessively low, then attack on the photosensitive film is avoided, but a tailing phenomenon occurs
Solution Approach 1:
The patent optimizes the concentration ratios of different organic solvents and the amount of multifunctional carboxylic acid compound to enhance the thinner's effectiveness, ensuring complete removal of concentrated photoresist without causing tailing while maintaining film integrity
3Manufacturing precision
If the volatility of the thinner composition is too low, then the thinner remains on the surface longer for better removal, but it acts as a source of contamination in subsequent etching process
Solution Approach 1:
The patent selects organic solvents with appropriate volatility characteristics and adjusts their proportions to ensure the thinner evaporates completely after removal operations, eliminating contamination sources while maintaining effective photoresist removal capability
4Object-generated harmful factors
If the volatility of the thinner composition is too high, then contamination is reduced, but the substrate is rapidly cooled resulting in significant variation in film thickness
Solution Approach 1:
The patent carefully controls the volatility parameters of the thinner composition by selecting specific organic solvents and their ratios, achieving a balance where the thinner evaporates sufficiently to prevent contamination but not so rapidly as to cause substrate cooling and film thickness variation
5Device complexity
If conventional thinner compositions are used, then the process is simple, but the photosensitive film thickness is not uniform due to edge bead formation
Solution Approach 1:
The patent modifies the chemical composition parameters of the thinner to include specific organic solvents and multifunctional carboxylic acid compounds that prevent edge bead formation, achieving uniform film thickness without complicating the application process
Solution Approach 2:
The thinner uses a composite formulation combining multiple organic solvent types with a multifunctional carboxylic acid compound to prevent edge bead formation and achieve uniform photoresist film thickness while maintaining process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves uniform thickness and efficient edge bead removal, improving process efficiency and reducing contamination risks while maintaining film quality.
Implementation Method 1
a thinner composition which includes organic solvents
Implementation Method 2
the thinner composition is required to have characteristic of easily evaporating after removing a photosensitive resin and not remaining on the surface of the substrate
Data Source
AI summary
A thinner composition includes a multifunctional carboxylic acid compound, a first organic solvent having a dielectric constant of 35 or more, and a second organic solvent having a dielectric constant of less than 35. When including organic solvents having different dielectric constants together and the multifunctional carboxylic acid compound, an amount of the photoresist used may be reduced and thickness uniformity of the photosensitive film may be implemented.