NAND Memory Punch-Through Disturb Reduction via Localized Word Line Biasing

Solution Overview

Problem

Program disturb and punch-through effects in NAND memory arrays lead to unintended changes in threshold voltages of unprogrammed or programmed cells, particularly affecting source-side word lines, which existing boosting schemes fail to adequately address.

Innovation Solution

A self-boosting method is implemented where unselected word lines are biased with specific voltage levels, including ground potential and low voltage biases on the source-side, and incremental programming pulses are applied to reduce punch-through disturb by minimizing voltage drops across turned-off word lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a boosting scheme biases unselected word lines with high voltage (e.g., 10V) to reduce program disturb, then program disturb is reduced, but punch-through occurs on nearby word lines causing threshold voltage increase

Engineering Contradiction:
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent applies different voltage biases to different word lines based on their position relative to the selected word line. Source-side unselected word lines receive a first bias voltage (e.g., 10V) while drain-side unselected word lines receive a second bias voltage (e.g., 0V or low voltage). This localized differentiation prevents punch-through on source-side word lines while maintaining program disturb reduction effectiveness.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the word lines into distinct groups: source-side unselected word lines, drain-side unselected word lines, and the selected word line itself. Each segment receives a tailored bias voltage appropriate to its function and position, allowing independent control of punch-through and program disturb effects in different regions of the memory array.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If high voltage is applied to reduce program disturb, then programming accuracy improves, but unintended state changes occur in unprogrammed cells

Engineering Contradiction:
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies high voltage (first bias voltage) specifically to source-side unselected word lines where punch-through is most problematic, while applying low or zero voltage to drain-side unselected word lines. This localized approach maintains programming accuracy in the target area while preventing unintended state changes in other areas through selective voltage application.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS8164950B2Reduction of punch-through disturb during programming of a memory device
Publication Date: 2012.04.24
  • US8164950B2 patent drawing
  • US8164950B2 patent drawing
  • US8164950B2 patent drawing

AI summary

A punch-through disturb effect in a memory device can be reduced by biasing a selected word line at a program voltage to program a selected memory cell, biasing word lines on the drain side of the series string with a Vpass voltage, turning off an adjacent memory cell to the selected memory cell, and biasing remaining word lines on the source side of the turned-off memory cell with a Vlow voltage that is less than Vpass.