NAND Flash Thermal Management via Workload-Adaptive Throttling

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Solution Overview

Problem

NAND flash devices experience data errors due to temperature-dependent charge trapping, leading to reduced performance and storage capacity under high-thermal conditions, as existing solutions like disabling device components or throttling throughput can compromise performance and user experience.

Innovation Solution

Implementing a workload analysis in conjunction with temperature monitoring to dynamically adjust the operation of NAND flash devices, throttling resources only when necessary to manage high temperatures, and refraining from throttling during low-workload conditions to maintain performance and prevent data corruption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If device components are disabled or throughput is throttled to manage high temperatures, then thermal conditions are improved, but performance and user experience deteriorate

Engineering Contradiction:
Improvethermal conditionVSAvoidperformance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent implements dynamic thermal management by continuously monitoring temperature and workload conditions, and adjusting device operation in real-time. The system transitions between different operational states (normal operation, throttling, disabling) based on current conditions, allowing optimal performance when cool and protective throttling only when necessary, thus resolving the contradiction between maintaining performance and managing thermal conditions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes operational parameters (throughput rate, active components) based on temperature and workload measurements. By dynamically adjusting these parameters rather than maintaining fixed operation, the system can preserve high performance during low-temperature periods while implementing protective throttling during high-temperature conditions, resolving the trade-off between performance and thermal management.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If throughput is throttled during high-temperature conditions, then data errors are reduced, but productivity decreases

Engineering Contradiction:
Improvedata error rateVSAvoidthroughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent employs feedback mechanisms by monitoring temperature conditions and workload levels, then using this information to dynamically adjust throughput. The system only throttles when temperature exceeds thresholds combined with high workload conditions, and maintains full throughput when conditions are favorable, thus protecting data reliability while minimizing impact on productivity.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system applies throttling selectively rather than continuously - only when temperature and workload conditions both indicate risk. This partial action approach protects against data errors only when necessary, rather than constantly limiting throughput, thus maintaining high productivity during safe operating conditions while ensuring reliability when thermal stress is present.

Inventive Principle:
Principle #16Partial or excessive action

3Reliability

If device operation is modified based on temperature monitoring, then thermal safety is improved, but device complexity increases

Engineering Contradiction:
Improvethermal safetyVSAvoidoperation control
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements self-service thermal management where the device monitors its own temperature and workload conditions, and autonomously adjusts its operation without external intervention. The controller automatically determines when to throttle or disable components based on internal sensors and predefined thresholds, eliminating the need for complex external thermal management systems while ensuring thermal safety.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10424382B2Increased NAND performance under high thermal conditions
Publication Date: 2019.09.24 MICRON TECHNOLOGY INC
  • US10424382B2 patent drawing
  • US10424382B2 patent drawing
  • US10424382B2 patent drawing

AI summary

Devices and techniques for increased NAND performance under high thermal conditions are disclosed herein. An indicator of a high-temperature thermal condition for a NAND device may be obtained. A workload of the NAND device may be measured in response to the high-temperature thermal condition. Operation of the NAND device may then be modified based on the workload and the high-temperature thermal condition.