Nanoribbon-Based Capacitors for Semiconductor Integration

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Solution Overview

Problem

Conventional capacitors in semiconductor integrated circuits require additional process steps and masks, increasing integration costs and area, and often need separation from active devices, limiting their integration and performance.

Innovation Solution

The use of nanoribbon-based capacitors, where stacks of nanoribbons serve as both capacitor electrodes, allowing for closer placement to active devices and reduced process changes, enabling the implementation of additional circuit blocks like BJTs with modest fabrication modifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional capacitors are used in semiconductor integrated circuits, then capacitor functionality is achieved, but additional process steps and masks are required, increasing integration costs and area

Engineering Contradiction:
Improveintegration costVSAvoidprocess steps
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The nanoribbon stack structure serves multiple functions: it acts as both the active device channel and the capacitor electrodes. The same nanoribbons that form the transistor channel are used as capacitor plates, eliminating the need for separate capacitor fabrication processes and reducing overall device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the capacitor structure with the active device by using the nanoribbon stack to form both the transistor channel and capacitor electrodes simultaneously. This integration eliminates separate capacitor components and reduces the number of fabrication steps required

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If conventional capacitors are used, then capacitor functionality is achieved, but they require separation from active devices, limiting integration

Engineering Contradiction:
Improveintegration with active devicesVSAvoidarea requirements
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The capacitor electrodes are nested within the same vertical space as the active device channel. The nanoribbon stack is configured so that capacitive elements are positioned between and around the channel-forming nanoribbons, allowing capacitors to be embedded within the active device structure rather than placed separately

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention transitions from planar capacitor布局 to a vertical three-dimensional arrangement. By stacking nanoribbons vertically and positioning capacitor electrodes in the vertical dimension between channel nanoribbons, the design achieves high integration density without increasing lateral area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If additional circuit blocks like BJTs are implemented, then circuit functionality is enhanced, but fabrication complexity increases

Engineering Contradiction:
Improvecircuit block implementationVSAvoidfabrication modifications
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The nanoribbon stack structure provides a universal platform that can form different device types including transistors, capacitors, and bipolar junction transistors. By configuring the same basic nanoribbon stack in different ways, multiple circuit blocks can be fabricated using the same fundamental process steps

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The nanoribbon stack is segmented into different functional regions where specific nanoribbons serve different purposes. By selectively doping or configuring individual nanoribbons within the stack, different device functionalities can be created from the same structural platform without requiring completely different fabrication processes

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20230187477A1Nanoribbon-based capacitors
Publication Date: 2023.06.15 INTEL CORP
  • US20230187477A1 patent drawing
  • US20230187477A1 patent drawing
  • US20230187477A1 patent drawing

AI summary

Capacitors based on stacks of nanoribbons and associated devices and systems are disclosed. In particular, a stack of at least two nanoribbons may be used to provide a two-terminal device referred to herein as a “nanoribbon-based capacitor,” where one nanoribbon serves as a first capacitor electrode and another nanoribbon serves as a second capacitor electrode. Using portions of nanoribbon stacks to implement nanoribbon-based capacitors could provide an appealing alternative to conventional capacitor implementations because it would require only modest process changes compared to fabrication of nanoribbon-based FETs and because nanoribbon-based capacitors could be placed close to active devices. Furthermore, with a few additional process steps, nanoribbon-based capacitors may, advantageously, be extended to implement other circuit blocks such as nanoribbon-based BJTs or three-nanoribbon arrangements with a common connection between two anodes and a separate connection to a cathode.