Nanosheet FET Separation Wall Structure for Patterning Margin

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Solution Overview

Problem

The rapid down-scaling of integrated circuit devices increases the likelihood of process defects in nanosheet field-effect transistors, affecting performance and reliability.

Innovation Solution

The integrated circuit device incorporates a novel structure with hammer-shaped or nail-shaped sheet separation walls between nanosheet stack structures, securing patterning margins, increasing effective channel width, and preventing leakage current, thereby enhancing manufacturing ease and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional nanosheet field-effect transistor structures are used, then device density is maintained, but process defects increase and reliability decreases due to rapid down-scaling

Engineering Contradiction:
Improvetransistor reliabilityVSAvoidprocess defect rate
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The device structure is segmented into multiple nanosheet stack structures (first and second stacks) separated by sheet separation walls. This segmentation allows independent formation and reduces process defects in each stack, improving overall manufacturing precision and reliability while maintaining high device density.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Sheet separation walls are introduced as intermediary structures between adjacent nanosheet stack structures. These walls provide physical separation that prevents defect propagation and enables independent processing, thereby reducing overall process defect rates and improving transistor reliability during down-scaling.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If sheet separation walls are added between nanosheet stacks, then patterning margins are secured and reliability improves, but device structure complexity increases

Engineering Contradiction:
Improvemanufacturing reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The complex structure is divided into modular nanosheet stacks separated by standard sheet separation walls. Each module can be formed using similar processes, making the complexity manageable and repeatable, thereby improving manufacturing reliability without prohibitive complexity increases.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sheet separation walls serve multiple functions: they provide patterning margins, act as physical barriers between stacks, and enable independent processing. This multi-functionality justifies the added structural complexity by delivering multiple reliability benefits simultaneously.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If hammer-shaped or nail-shaped sheet separation walls are used, then leakage current is prevented and performance stability improves, but manufacturing complexity increases

Engineering Contradiction:
Improveperformance stabilityVSAvoidmanufacturing ease
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The sheet separation walls feature localized geometric variations (hammer-shaped or nail-shaped profiles) at specific locations to prevent leakage current paths. This local quality enhancement targets specific performance issues without requiring complex manufacturing throughout the entire device, maintaining reasonable ease of manufacture while improving performance stability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The complex wall shapes are designed to convert potential leakage pathways into beneficial features by creating physical barriers and electric field management structures that actively prevent leakage, transforming what would be simple separation walls into active reliability enhancement elements.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS20260006902A1Integrated circuit device
Publication Date: 2026.01.01 SAMSUNG ELECTRONICS CO LTD
  • US20260006902A1 patent drawing
  • US20260006902A1 patent drawing
  • US20260006902A1 patent drawing

AI summary

An integrated circuit device includes a hammer-shaped sheet separation wall between nanosheet stack structures, thereby improving a patterning margin of a gate electrode and preventing or reducing an effective channel width from being decreased. That is, the integrated circuit device may provide increased stable performance and improved reliability in a nanosheet field-effect transistor.