Nanowire Bundle Package Structure for Solder-Free Bonding
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Solution Overview
Problem
Current package structures face issues with undesired bridging between conductive terminals due to the use of soldering materials, which can lead to increased resistance, cracking, and reduced yield, especially with non-uniform distances between electronic modules and substrates, requiring additional planarization and reflow operations that may damage components.
Innovation Solution
A package structure utilizing a wire bundle structure with nanowires to connect electronic modules to substrates, eliminating the need for soldering and reducing warpage by fixing the relative position through tangled wires, thereby enhancing structural strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering materials are used to bond conductive terminals, then bonding between electronic components and substrates is achieved, but undesired bridging issues occur between conductive terminals
Solution Approach 1:
The patent removes soldering materials from the bonding process entirely, replacing them with a wire bundle structure that directly connects conductive terminals without causing bridging issues. The wire bundles are individually insulated and precisely positioned to maintain electrical isolation while providing mechanical bonding.
Solution Approach 2:
The wire bundle structure acts as an intermediary between the electronic component and substrate, replacing the problematic soldering material. The wires provide both electrical connection and mechanical bonding functions that were previously performed by solder, while avoiding the bridging harm caused by molten solder.
2Strength
If soldering materials are reflowed to achieve bonding, then bonding strength is improved, but cracking and yield reduction occur
Solution Approach 1:
The patent replaces the thermal-mechanical soldering process with a mechanical wire-based bonding system. Instead of using heat and pressure to melt and reflow solder, the wire bundles are mechanically inserted and secured, eliminating the thermal stress that causes cracking and yield reduction.
3Manufacturing precision
If additional planarization and reflow operations are performed to address non-uniform distances, then bonding uniformity is improved, but manufacturing complexity and component damage risk increase
Solution Approach 1:
The wire bundles are designed to be flexible and adaptable in length, allowing them to accommodate non-uniform distances between the electronic component and substrate without requiring additional planarization operations. Each wire can be individually adjusted to the appropriate length to span the gap at its location.
4Volume of moving object
If pitch between conductive terminals is decreased for miniaturization, then package size is reduced, but bridging issues between adjacent terminals increase
Solution Approach 1:
Each wire in the bundle is individually insulated with its own protective coating, providing localized electrical isolation. This allows wires to be placed in close proximity without risk of bridging, enabling the package to be miniaturized while maintaining reliability even at reduced pitch between terminals.
Data Source
AI summary
A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.