Negative Developing Apparatus Centrifugal Drying
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Solution Overview
Problem
The existing negative developing methods for semiconductor and glass substrates face issues with development defects like bridge defects due to the adherence of dissolution products during the surface drying process, which increases the usage of expensive cleaning liquids and reduces the quality of the developed patterns.
Innovation Solution
A negative developing method and apparatus that involves a puddle-forming step followed by a diluting step to reduce the concentration of dissolution products in the developer, and a surface drying step using centrifugal force to remove the developer and dissolution products without additional cleaning liquids, ensuring effective prevention of re-adhesion and reducing the usage of cleaning liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the surface drying step is performed without additional developer supply after the developing step, then the process is simple and quick, but the dissolution product concentration remains high causing re-adhesion and development defects
Solution Approach 1:
The patent applies preliminary action by supplying additional developer to the resist film immediately after the developing step, before the surface drying step begins. This preliminary dilution of dissolution products prevents their re-adhesion to the resist film during subsequent drying, thereby maintaining pattern quality without compromising development speed
2Manufacturing precision
If cleaning liquid is used to remove dissolution products during surface drying, then development defects are prevented, but the cost increases due to expensive organic solvent cleaning liquids
Solution Approach 1:
The patent uses additional developer (a disposable resource) instead of expensive cleaning liquid to remove dissolution products. The developer is supplied in excess and discarded after use, but it is cheaper than the organic solvent-based cleaning liquids traditionally used, thereby reducing costs while maintaining pattern quality
Solution Approach 2:
The patent introduces additional developer as an intermediary substance between the dissolution products and the resist film. This intermediary dilutes and carries away the dissolution products during the surface drying step, preventing direct re-adhesion to the resist film without requiring expensive cleaning liquids
3Device complexity
If the substrate is not rotated during surface drying, then the process is simpler, but dissolution products re-adhere to the resist film causing bridge defects
Solution Approach 1:
The patent applies preliminary action by supplying additional developer to dilute dissolution products before the centrifugal removal step. This preliminary dilution ensures that when the substrate is rotated during surface drying, the dissolved products are easily carried away by the flowing developer, preventing re-adhesion and maintaining pattern quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents development defects such as bridge defects, maintains high-quality development, and reduces the consumption of expensive cleaning liquids by utilizing centrifugal force to remove the developer and dissolution products during the surface drying step.
Implementation Method 1
a surface drying step of drying the surface of the substrate by rotating the substrate after the diluting step
Data Source
AI summary
Disclosed is a negative developing method including a puddle-forming step, a diluting step, and a surface drying step. In the puddle-forming step, developer containing an organic solvent is supplied to a resist film formed on a surface of the substrate and keeping a puddle of the developer on the resist film. In the diluting step, a concentration of a dissolution product dissolved in the developer on the resist film is diluted by additionally supplying the developer containing the organic solvent to the resist film after the puddle-forming step. In the surface drying step, the surface of the substrate is dried by rotating the substrate after the diluting step.