Negative Photosensitive Polyimide Resin for Low-Temperature Patterning
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Solution Overview
Problem
Existing photosensitive resin compositions for semiconductor devices face challenges in achieving high resolution and fine pattern formation with excellent mechanical characteristics, especially when cured at low temperatures, and there is a need for improved mechanical strength and adhesiveness.
Innovation Solution
A polymer with a polyimide precursor containing a specific structural unit, combined with a photo-radical initiator and optional crosslinking agents, forms a negative photosensitive resin composition that enables high resolution and mechanical strength even when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide film is used as a photosensitive insulation material, then insulation property and mechanical characteristics are improved, but high temperature curing (over 300°C) is required which limits substrate selection and causes copper circuit oxidation
Solution Approach 1:
The invention changes the chemical structure of the polyimide precursor by introducing flexible diamine components and specific structural units that enable low-temperature imidization. This parameter change in molecular structure allows the material to achieve full imidization and crosslinking at temperatures below 300°C while maintaining excellent insulation properties and mechanical strength.
Solution Approach 2:
The invention creates a composite photosensitive resin composition containing polyimide precursor, phenolic resin, and various additives. This composite formulation enables low-temperature curing by combining materials with complementary properties, achieving both low processing temperature and high performance insulation characteristics.
2Strength
If high temperature curing is used to obtain target polyimide film, then mechanical strength is improved, but substrate selection is limited and copper circuits are oxidized
Solution Approach 1:
The invention modifies the polyimide precursor structure to include flexible diamine components and specific structural units that enable low-temperature crosslinking. This structural parameter change allows achieving mechanical strength equivalent to or exceeding high-temperature cured films while expanding substrate compatibility to include temperature-sensitive substrates and copper circuits.
3Manufacturing precision
If photosensitive resin composition is designed for high resolution, then pattern resolution is improved, but mechanical characteristics and adhesiveness may deteriorate
Solution Approach 1:
The invention formulates a composite photosensitive resin composition combining polyimide precursor with phenolic resin and controlled molecular weight distribution. This composite approach enables simultaneous achievement of high pattern resolution through precise photo patterning and excellent mechanical characteristics through the synergistic effects of the composite material system.
Solution Approach 2:
The invention introduces specific structural units with different functions at different molecular locations - rigid segments for resolution and flexibility for mechanical strength. This local quality differentiation within the polymer chain enables both high pattern resolution and excellent mechanical properties in the cured film.
4Manufacturing precision
If patterned film is formed with good rectangularity, then lithography characteristics are improved, but mechanical strength and elongation may be compromised
Solution Approach 1:
The invention optimizes the polyimide precursor molecular structure by controlling molecular weight and introducing flexible diamine components. This parameter optimization enables the formation of patterns with excellent rectangularity while maintaining high mechanical strength and elongation through the balanced molecular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for fine pattern formation with excellent mechanical characteristics and adhesiveness, forming a cured film suitable as an interlayer insulating or surface protective film for semiconductor devices, enhancing reliability and performance.
Implementation Method 1
a negative photosensitive resin composition which includes the polymer (A), a photoradical initiator (B), and a solvent (E)
Data Source
AI summary
The present invention is a polymer having a polyimide precursor, where the polymer contains a structural unit represented by the following general formula (1), wherein at least one of R1-R4 represents a monovalent organic group having 1 to 15 carbon atoms; and at least one of Ra and Rb represents an organic group comprising an alpha,beta-unsaturated ester, such as an acrylic ester. This can provide: a polymer having a polyimide precursor, usable as a base resin for a negative photosensitive resin composition which enables fine pattern formation, provides high resolution, and has excellent mechanical characteristics even when cured at low temperatures; and a negative photosensitive resin composition which includes the polymer, and in patterning, is excellent in resolution and enables fine pattern formation, and has excellent mechanical characteristics even when cured at low temperatures.