Miniaturized Electronic Component with Nested Element Groups
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Solution Overview
Problem
Existing electronic components with multiple electronic elements connected in parallel to achieve desired electrical characteristics, such as large electrostatic capacitance, inevitably increase in size, making them unsuitable for limited mounting spaces on circuit boards.
Innovation Solution
The electronic component design includes a first and second electronic element group with external electrodes facing each other, connected via terminals that allow for parallel connection of laminated capacitors within a case, enabling miniaturization and secure mounting on circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple electronic elements are connected in parallel to achieve desired electrical characteristics, then electrostatic capacitance is improved, but component size increases
Solution Approach 1:
The patent places multiple electronic elements (first and second electronic element groups) inside a single housing, nesting them together with shared terminals. This allows multiple capacitive elements to be combined in parallel while maintaining a compact overall structure, resolving the contradiction between achieving high capacitance and keeping component size small
Solution Approach 2:
The patent merges multiple electronic elements and their terminals into a single integrated component structure. The first and second electronic element groups are combined within one housing, sharing common terminals, which enables parallel connection for increased capacitance without proportionally increasing the external dimensions of the component
2Quantity of substance
If multiple electronic elements are connected in parallel to achieve desired electrical characteristics, then electrostatic capacitance is improved, but mounting space increases
Solution Approach 1:
Multiple electronic element groups are nested within a single housing structure, allowing them to be mounted as one unit on a circuit board. This nesting approach enables the combination of multiple capacitive elements for high capacitance while occupying a limited mounting area on the circuit board
Solution Approach 2:
The patent arranges electronic element groups in different spatial dimensions (first and second directions) within the housing, utilizing three-dimensional space efficiently. This dimensional arrangement allows multiple elements to be packed closely together, achieving high capacitance without proportionally increasing the footprint area for mounting
Data Source
AI summary
A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.