Nested Interposer Package for Fine-Pitch Die Alignment
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Solution Overview
Problem
Current multi-chip integration architectures result in larger form factors and suffer from poor yield and reliability due to alignment issues and warpage, particularly in interconnections between dies.
Innovation Solution
The use of heterogeneous nested interposers with cavities that house nested components, allowing for self-alignment through bump pads and solder bumps to improve alignment and reliability, even with fine-pitched interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional packaging substrates are used for multi-die integration, then multiple dies can be packaged together, but the form factor increases and alignment precision deteriorates due to warpage
Solution Approach 1:
The patent introduces an interposer as an intermediary substrate between the multi-die integration platform and the dies. This interposer with cavities and embedded components serves as a mediator that enables precise alignment and integration of multiple dies while maintaining a compact form factor, resolving the contradiction between integration capability and alignment precision
Solution Approach 2:
The patent implements a nested structure where components are embedded within cavities in the interposer, and multiple functional layers are stacked vertically. This nesting approach allows multiple dies and components to be integrated in a three-dimensional arrangement, achieving high-density integration without increasing the lateral form factor, thus maintaining both integration capability and precision
2Adaptability or versatility
If traditional packaging substrates are used for multi-die integration, then multiple dies can be connected, but reliability deteriorates due to warpage and alignment issues
Solution Approach 1:
The interposer acts as a stable intermediary platform that provides a rigid, warp-resistant structure for die attachment. By distributing mechanical stresses through the interposer's cavity structure and embedded components, the system achieves improved reliability and yield while maintaining multi-die integration capability
Solution Approach 2:
The patent employs localized reinforcement strategies by embedding specific components within cavities at critical locations in the interposer. This local quality enhancement provides targeted structural support and stress distribution, improving overall reliability without requiring a complete redesign of the entire substrate
3Volume of moving object
If finer-pitched interconnects are used to reduce form factor, then integration density increases, but manufacturing precision requirements become more stringent
Solution Approach 1:
The patent transitions from two-dimensional planar interconnect arrangements to three-dimensional vertical stacking with cavities and embedded components. This dimensional change allows finer-pitched interconnects to be implemented in the vertical dimension while the interposer provides precise alignment references, enabling reduced form factor without compromising manufacturing precision
Solution Approach 2:
The patent replaces traditional mechanical alignment methods with self-aligning features integrated into the interposer structure. The cavities and embedded components provide inherent mechanical guidance and positioning, enabling precise interconnect formation at finer pitches without requiring overly stringent external alignment processes
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C~2D
AI summary
Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.