Nested Microstrip Transmission Lines for 5G Baseband Resonance
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Solution Overview
Problem
Conventional high power amplifiers, such as Doherty power amplifiers, face limitations in achieving sufficient baseband equivalent resonance to meet current multiband or 5G LTE wideband standards, requiring increased PCB footprint and inadequate signal bandwidth, and struggle with high value capacitor usage due to second harmonic impacts.
Innovation Solution
The implementation of nested microstrip transmission lines on a printed circuit board, where low frequency baseband terminations are embedded within high frequency impedance matching transformers, allowing independent signal paths for RF and baseband signals, reducing equivalent bias line feed inductance and eliminating the need for high value capacitors, while optimizing PCB footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dual symmetrical bias lines are used to achieve increased baseband equivalent resonance, then the equivalent inductance is reduced by half, but the PCB footprint is increased
Solution Approach 1:
The patent implements nested microstrip transmission lines where an inner microstrip line is positioned within the electromagnetic field region of an outer microstrip line. This nesting configuration allows both bias lines to share the same PCB space, achieving increased baseband equivalent resonance through parallel combination while maintaining a compact PCB footprint by eliminating the need for separate spatial arrangement of conventional dual symmetrical bias lines
2Reliability
If conventional bias line implementations are used, then baseband equivalent resonance is improved by a factor of square root of two, but the signal bandwidth is insufficient for 5G LTE wideband standards
Solution Approach 1:
The patent employs discontinuity structures (such as gaps or variations in trace geometry) along the microstrip transmission lines to introduce controlled impedance transformations. These parameter changes enable the bias lines to provide both increased baseband equivalent resonance and extended signal bandwidth, allowing the system to meet 5G LTE wideband requirements while maintaining the resonance benefits
3Reliability
If high value capacitors are used in conventional bias line designs, then baseband termination is achieved, but second harmonic impacts degrade performance
Solution Approach 1:
The patent extracts and eliminates the need for high value capacitors from the bias line design by using the nested microstrip transmission lines themselves to provide baseband termination functionality. This extraction removes the source of second harmonic generation associated with capacitor-based termination while maintaining effective baseband resonance and termination through the distributed impedance characteristics of the nested transmission line structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances baseband resonance and signal bandwidth, reduces PCB footprint, and enables compliance with multiband 5G LTE standards by maintaining or reducing the overall PCB space, while allowing for higher Ropt devices and tuning of harmonic impedances.
Implementation Method 1
a first conductive trace is configured to communicate one or more first electromagnetic signals having one or more first frequencies, and a second conductive trace positioned within a first interior orifice of the first conductive trace is configured to communicate one or more second electromagnetic signals having one or more second frequencies
Implementation Method 2
a first non-conductive gap portion of the first interior orifice exists between the second conductive trace and the first conductive trace so that the second conductive trace is electrically isolated from the first conductive trace
Data Source
AI summary
Nested microstrip systems and methods, and systems and methods encompassing same, are disclosed herein. In one example, a nested microstrip system includes a printed circuit board (PCB) having first and second layer levels, where first and second conductive traces are positioned at the second layer level. The first conductive trace is configured to include an orifice, and to extend between first and second locations along a first path, and the second conductive trace is positioned within the orifice. A non-conductive gap portion of the orifice exists between the first and second conductive traces so that the second conductive trace is electrically isolated from the first conductive trace. One or more first electromagnetic signals can be propagated along a first part of the first conductive trace, and one or more second electromagnetic signals can be propagated along at least a second part of the second conductive trace.