Nested SLIC Connector Architecture for High Density I/O
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Solution Overview
Problem
Current data storage systems face limitations in expanding I/O capabilities due to the finite number of Small Logic Interface Cards (SLIC) slots and mechanical constraints of traditional SLIC connectors, which restrict the utilization of increased PCIe communication lines and I/O density.
Innovation Solution
The implementation of SLIC form factor I/O cards with modified connectors and mechanical guidance systems that enable doubling the I/O density by utilizing more PCIe lanes, allowing for increased I/O communication lines and translation of PCIe to various output types such as Fiber, FICON, Ethernet, SAS, SATA, Infiniband, and SRIO, while maintaining airflow for cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional SLIC connectors are used, then the system maintains mechanical stability and ease of manufacture, but the I/O density and PCIe lane utilization are limited
Solution Approach 1:
The patent implements a nested connector architecture where a second connector is positioned within the structure of a first connector. The I/O board includes both a first SLIC connector and a second connector that nests within it, allowing multiple connectors to occupy the same physical space. This enables doubled I/O density without proportionally increasing the overall device footprint or mechanical complexity.
Solution Approach 2:
The patent transitions from a single-plane connector arrangement to a multi-dimensional nested structure. By placing the second connector within the spatial envelope of the first connector rather than adjacent to it, the design utilizes three-dimensional space more efficiently, thereby increasing I/O density without linearly increasing the board area or mechanical complexity.
2Quantity of substance
If more SLIC slots are added to expand I/O capabilities, then the PCIe lane density increases, but the chassis complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple connector functions into a single integrated assembly. The I/O board incorporates both the first SLIC connector and the second nested connector on the same board, allowing dual I/O streams to be achieved through one manufacturing unit rather than requiring separate slots and boards, thereby simplifying chassis manufacturing.
Solution Approach 2:
The nested connector design creates a universal interface structure that can handle multiple I/O protocols and types through a single physical connector assembly. The first and second connectors share the same mechanical mounting structure and can both interface with the chassis through the nested arrangement, reducing the need for multiple specialized connector types.
3Quantity of substance
If I/O wafers are stacked to increase density, then the I/O capability doubles, but the airflow obstruction and cooling challenges increase
Solution Approach 1:
The I/O wafers are arranged in a nested configuration where the second connector and its associated wafer are positioned within the structural envelope of the first connector assembly. This nested stacking allows high I/O density while maintaining vertical integration that preserves horizontal airflow paths through the chassis, reducing cooling obstruction compared to lateral arrangements.
Data Source
AI summary
An apparatus and system for processing I/O from a data storage chassis, the apparatus and system comprising a first I/O printed circuit board (PCB) including I/O wafers; wherein the I/O wafers of the first I/O PCB are enabled to receive I/O from the data storage chassis; a second I/O PCB including I/O wafers; wherein the I/O wafers of the second I/O PCB are enabled to receive I/O from the data storage chassis; wherein the I/O wafers of the first I/O PCB is constructed and configured to receive the I/O wafers of the second I/O PCB.