Nested Via Interconnect Layout for Dense Shielded Package Substrates

The patent implements nested via interconnect structures where a first via interconnect with a partial concentric planar cross section is surrounded by a second via interconnect with a partial ring planar cross section. This nesting arrangement increases interconnect density within the same substrate area without requiring additional lateral space, effectively resolving the contradiction between density and complexity by organizing multiple interconnects in a compact concentric configuration

The patent transitions from traditional two-dimensional planar interconnect layouts to a three-dimensional nested configuration. By stacking via interconnects with different cross-sectional geometries (partial concentric and partial ring) in vertical alignment, the design exploits the vertical dimension to achieve higher interconnect density without proportionally increasing the substrate footprint, thereby improving productivity while managing structural complexity

The nested via interconnect configuration allows multiple interconnects to occupy the same lateral footprint on the substrate. The first via interconnect with partial concentric cross section and the second via interconnect with partial ring cross section are positioned concentrically, enabling high interconnect density without expanding the substrate area, thus resolving the contradiction between density and package size

By utilizing vertical stacking and three-dimensional spatial arrangement of via interconnects, the patent achieves increased interconnect density within the same planar substrate area. The nested configuration exploits the vertical dimension and radial spacing to pack more interconnects into a compact footprint, preventing package size expansion while improving electrical performance

The nested via interconnect structure provides inherent electromagnetic shielding where the outer second via interconnect with partial ring cross section surrounds the inner first via interconnect with partial concentric cross section. This concentric arrangement creates a shielded configuration that protects against electromagnetic interference while maintaining a compact structure, resolving the contradiction between shielding effectiveness and manufacturing complexity by integrating shielding functionality into the interconnect geometry itself

The via interconnects serve multiple functions simultaneously: they provide electrical connectivity and embedded electromagnetic shielding. The nested configuration of the first and second via interconnects creates a shielded structure that protects sensitive signals while maintaining standard manufacturing processes, thereby achieving EMI protection without proportionally increasing device complexity