Neural Processing Unit Runtime Testing for Defect Isolation
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Solution Overview
Problem
The integration of neural processing units (NPUs) in system-on-chip (SoC) or system-in-package (SiP) increases complexity, leading to higher defect rates during manufacturing, which can result in unpredictable AI operation failures in critical applications like autonomous vehicles and AI robots, as minute defects are difficult to detect before shipment.
Innovation Solution
An in-system component tester (ICT) is used to test functional components during runtime, selecting components in an idle state, monitoring their states, and isolating them from the system bus for testing, with features like a scheduler, generator, and tester to analyze test results and replace defective components with spare components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If neural processing units are integrated in system-on-chip or system-in-package, then manufacturing cost is reduced and size is decreased, but complexity increases leading to higher defect rates
Solution Approach 1:
The system divides the SoC/SiP into multiple functional components (first functional component, second functional component, etc.) that can be independently tested. Test wrappers are assigned to specific components to isolate testing, allowing complex integrated systems to be managed through segmented, component-level verification while maintaining the cost and size benefits of integration.
2Area of stationary object
If multiple semiconductor components are integrated in SoC or SiP, then board substrate size is reduced, but defect detection difficulty increases
Solution Approach 1:
Test wrappers serve as intermediary components between the functional components and the testing system. Each test wrapper is specifically assigned to test a particular functional component, acting as a mediator that simplifies the detection process. This intermediary layer enables systematic testing of minute defects in densely integrated components without requiring complex external testing equipment.
Solution Approach 2:
The system performs preliminary testing by assigning test wrappers to functional components before the system is shipped. This preliminary action identifies and isolates defective components early in the manufacturing process, preventing defective units from reaching customers. The testing is conducted during the manufacturing phase rather than waiting for field failures.
3Reliability
If functional components are tested during runtime, then defective components can be identified, but system operation is interrupted
Solution Approach 1:
The system implements periodic testing where test wrappers are assigned to functional components at scheduled intervals during runtime. The processor alternates between executing application programs and executing test programs through periodic context switching. This periodic action enables defect detection during operation without requiring continuous system shutdown, balancing reliability improvement with minimal operational disruption.
Solution Approach 2:
The system dynamically switches between normal operation mode and testing mode. The processor can dynamically allocate resources to testing when functional components are in idle state, and return to normal operation when testing is complete or defective components are identified. This dynamic adaptation allows the system to maintain high availability while performing necessary defect detection.
Data Source
AI summary
This disclosure proposes an inventive system capable of testing a component in the system during runtime. The system may comprise: a substrate; a plurality of functional components, of the plurality of functional components being mounted onto the substrate and including a circuitry; a system bus formed with electrically conductive pattern onto the substrate thereby allowing the plurality of functional components to communicate with each other; one or more wrappers, each of the one or more wrappers connected to one of the plurality of functional components; and an in-system component tester (ICT) configured to: select, as a component under test (CUT), at least one functional component, in an idle state, of the plurality of the functional components; and test, via the one or more test wrappers, the at least one functional component selected as the CUT.